Wafer Inspection Probe Loops for Simultaneous Die Testing
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Solution Overview
Problem
Conventional wafer inspection methods require multiple test devices or numerous channels, leading to high inspection costs and inefficient testing of multiple dies simultaneously.
Innovation Solution
A wafer inspection apparatus and method utilizing a probe module with first and second probes, a processing module, and a switch group to form test loops for individual dies, enabling simultaneous electrical testing through reference voltages, reducing the need for external test devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple test devices or numerous channels are used to inspect all dies simultaneously, then inspection efficiency is improved, but inspection cost increases
Solution Approach 1:
The patent merges the test device functionality directly into the wafer inspection apparatus by integrating a processing module that includes a driver, comparing unit, and logic element. This integration allows the inspection apparatus to simultaneously perform electrical testing of multiple dies using a single device, eliminating the need for multiple separate test devices and reducing overall inspection cost while maintaining high inspection efficiency
Solution Approach 2:
The processing module is designed to perform multiple functions: providing driving current through first probes, obtaining inspection voltage through second probes, comparing voltages against reference values, and determining inspection results. This multi-functional design consolidates what would traditionally require multiple specialized test devices into a single apparatus, reducing cost while maintaining the ability to inspect all dies simultaneously
2Productivity
If multiple test devices are used to complete simultaneous inspection, then inspection efficiency is improved, but device complexity increases
Solution Approach 1:
The patent combines the functionality of multiple test devices into a single integrated inspection apparatus. The processing module incorporates all necessary components (driver, comparing unit, logic element) that would traditionally be distributed across multiple separate test devices, thereby reducing the number of devices required while maintaining the capability to inspect all dies simultaneously
3Productivity
If a single test device provides more channels for simultaneous inspection, then inspection efficiency is improved, but device complexity increases
Solution Approach 1:
The patent segments the wafer into multiple inspection regions, each containing multiple dies. The processing module is configured to independently test each die within a region by selectively establishing test loops through switch groups. This segmentation allows a single device to manage multiple dies simultaneously through organized control, increasing inspection efficiency without proportionally increasing device complexity
Data Source
AI summary
A wafer inspection apparatus that perform a voltage inspection of a die on a wafer by a probe module. The probe module includes a processing module, a first probe coupled to a first electrode point of the die, and a second probe coupled to a second electrode point of the die. The first probe is coupled to the processing module, and the second probe is grounded. The processing module provides the die with a driving current through the first probe, and obtains an inspection voltage corresponding to the die. The inspection result indicates an operating status of the die. Thus, inspection costs are reduced and inspection efficiency is enhanced.