Wafer Probe Card Testing With Multi-Touchdown Die Segmentation

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Solution Overview

Problem

The existing method of semiconductor device testing using a probe card results in poor yield due to excessive temperature or insufficient voltage, and excessive probe marks on dies during repeated touchdowns, leading to customer dissatisfaction.

Innovation Solution

A method involving multiple touchdowns with a chuck moving to different expected positions under a probe card, allowing individual testing of die portions without leaving the pins, thereby reducing probe marks and maintaining consistent testing conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the probe card performs single testing by single touchdown, then the testing process is simple, but 1536 DUTs await for the single testing and poor yield occurs due to excessive temperature or insufficient voltage

Engineering Contradiction:

Improvenumber of DUTs testedVSAvoidyield

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent divides the testing process into multiple touchdowns, where each touchdown tests a specific portion of dies. This segmentation allows 1536 DUTs to be tested across multiple touches rather than a single touchdown, improving productivity while maintaining reliable testing conditions for each portion.

Inventive Principle:

Principle #1Segmentation

2Reliability

If the testing is disassembled into several touchdowns, then the number of DUTs tested in single testing can be reduced and yield improved, but excessive probe marks occur on DUTs during subsequent PMI inspection

Engineering Contradiction:

ImproveyieldVSAvoidprobe marks

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent applies local quality by testing different portions of dies at different locations during multiple touchdowns. Each touchdown tests a specific local portion without requiring the pins to return to original coordinates, thereby reducing probe marks on individual DUTs while maintaining overall testing reliability.

Inventive Principle:

Principle #3Local quality

3Adaptability or versatility

If pins are inspected and returned to original coordinates for another touchdown, then subsequent testing can be performed, but excessive probe marks are created on DUTs

Engineering Contradiction:

Improvetesting capabilityVSAvoidprobe marks

Core Design Contradiction:

Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

The patent implements dynamics by allowing the chuck to remain at the second expected position during subsequent touchdowns instead of returning to original coordinates. This dynamic positioning enables multiple testing operations without repeatedly probing the same locations, thereby reducing probe marks while maintaining testing versatility.

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS20260086120A1Method of testing semiconductor device

Publication Date: 2026.03.26 NAN YA TECH

AI summary

The present disclosure provides a method of testing a semiconductor device. The method includes: providing a wafer on a chuck; moving the chuck to a first expected position under a probe card; moving the chuck from the first expected position to a second expected position so that a plurality of dies of the wafer contact a plurality of pins of the probe card; testing a first portion of the dies of the wafer; moving the chuck to the second expected position so that the dies of the wafer abut against the pins of the probe card; and testing a second portion of the dies of the wafer.