Wafer Probe System with Multi-Wavelength Illumination
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Solution Overview
Problem
Current wafer level probe systems lack the capability to conduct concurrent reliability studies of illumination and electrical stimulation, particularly in emerging technologies like transparent electronics, which are sensitive to various photonic energies and require controlled light spectrum and intensity testing.
Innovation Solution
A wafer level electrical probe system with multiple wavelength and intensity illumination capabilities, comprising a controllable wavelength and intensity illumination input sub-system, wafer level electrical probe sub-system, illumination intensity calibration sub-system, illumination wavelength calibration sub-system, and illumination delivery sub-system, allowing for precise and controlled illumination and electrical stimulation of semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional wafer probe systems are used, then productivity and throughput are optimized, but the capability to conduct concurrent illumination and electrical stimulation studies is lacking
Solution Approach 1:
The patent combines illumination testing capabilities and electrical stimulation capabilities into a single integrated wafer probe system. The illumination source, optical components, and electrical probe station are merged into one system that can deliver both optical and electrical stimuli simultaneously to semiconductor devices, enabling concurrent reliability studies without requiring separate testing equipment.
Solution Approach 2:
The probe system is designed to perform multiple functions: it can conduct electrical probing, deliver controlled illumination at various wavelengths and intensities, and perform concurrent illumination-electrical stimulation studies. This multi-functional design allows a single system to replace multiple separate testing tools, enhancing versatility while managing complexity through integration.
2Measurement precision
If simple light bulbs or general spectrum LEDs are used for illumination, then the system is simple, but precise control of light spectrum and intensity is not achieved
Solution Approach 1:
The illumination system uses dynamically adjustable parameters including variable wavelength selection and controllable intensity levels. The system can adapt the illumination characteristics in real-time based on testing requirements, allowing precise control of spectral content and intensity to study device responses under specific photonic conditions.
Solution Approach 2:
The patent implements precise control over illumination parameters including wavelength, intensity, and spectral composition. By systematically varying these parameters, the system can deliver well-defined photonic stimuli to semiconductor devices, enabling quantitative studies of material responses to different illumination conditions with high measurement precision.
3Reliability
If conventional probe systems without illumination control are used, then manufacturing simplicity is maintained, but reliability studies under controlled illumination conditions cannot be conducted
Solution Approach 1:
The probe system is divided into distinct functional modules: an illumination delivery subsystem with controllable light sources and optical components, an electrical probing subsystem with probe cards and contact mechanisms, and a control subsystem for coordinating both functions. This segmentation allows each module to be optimized independently while integrating into a unified system for comprehensive reliability testing.
Data Source
AI summary
A wafer level electrical probe system with multiple wavelength and intensity illumination capability system that enables concurrent reliability studies of illumination stimulation, electrical stimulation, and the interplay of both electrical and illumination stimulation. The probe system includes five sub-systems: a controllable wavelength and intensity illumination input sub-system with two different configurations; a wafer level electrical probe sub-system; an illumination intensity calibration sub-system; an illumination delivery sub-system; and an illumination wavelength calibration sub-system.


