Wafer Probe Station Temperature Stability Verification
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Solution Overview
Problem
Existing wafer probe stations face challenges in determining whether the temperature of the probe assembly is stable for calibration at the auxiliary site and when it needs to be heated or cooled at the wafer site, leading to unreliable calibration and test results due to temperature variations.
Innovation Solution
The wafer probe station includes a probe assembly and a computer that measures an air standard at the auxiliary site to provide a dataset, which is then verified against a predetermined signal range to determine temperature stability for calibration. Additionally, the station measures a calibration standard when stability is confirmed, and adjusts the temperature of the probe assembly at the wafer site as necessary based on these measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the probe assembly travels between wafer site and auxiliary site for calibration, then both processes can be performed in separated sites, but temperature stability cannot be ensured leading to unreliable calibration results
Solution Approach 1:
The system continuously monitors temperature at both wafer site and auxiliary site, and uses this feedback to control heating/cooling devices. The computer compares temperature data and automatically adjusts temperature to maintain stability within predetermined ranges, ensuring reliable calibration results while allowing separated process sites
Solution Approach 2:
The temperature control system operates automatically without manual intervention. The computer monitors temperature conditions and self-adjusts heating or cooling as needed based on predetermined temperature ranges, making the system self-regulating and eliminating the need for manual temperature management during probe assembly travel between sites
2Device complexity
If temperature control is only available at wafer site, then device complexity is reduced, but temperature adjustment time increases during calibration process
Solution Approach 1:
The system proactively monitors temperature conditions and initiates heating or cooling operations before the probe assembly arrives at the auxiliary site. By predicting temperature changes and acting in advance, the system ensures temperature stability is achieved without delaying the calibration process, thus reducing overall temperature adjustment time while maintaining simple device architecture
3Temperature
If multiple temperature adjustments are made during calibration, then temperature stability can be maintained, but measurement precision decreases due to frequent temperature changes
Solution Approach 1:
The system dynamically adjusts temperature control based on real-time conditions and probe assembly location. Rather than making frequent fixed adjustments, the system adapts its control strategy to minimize temperature changes during measurement phases while ensuring stability is achieved when needed, thereby maintaining both temperature stability and measurement precision
Data Source
AI summary
To determine whether the current temperature of a probe assembly is stable for the calibration at the auxiliary site, a wafer probe station verifies a measured air standard dataset with a predetermined signal range or verifying an estimated measurement time range with a predetermined time window. To determine whether adjusting the current temperature of a probe assembly at the wafer site is necessary, a wafer probe station verifies a measured air standard dataset with a predetermined signal range or verifying an estimated measurement time range with a predetermined time window. To determine whether the current temperature of a probe assembly is ready for testing a semiconductor device, a wafer probe station verifies a measured air standard dataset with a predetermined signal range.