Reconfigurable Wafer Probe Switches for Multi-Layout Testing
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Solution Overview
Problem
Existing multi-contact wafer probes require separate production for each electronic component with a different contact layout, leading to increased costs and complexity due to fixed electrical paths for testing.
Innovation Solution
Incorporating a switch with at least three positions in each conductor, allowing for direct or buffered ground connections, enabling flexible path configuration to match various contact layouts without needing new probes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multi-contact wafer probe is designed with fixed electrical paths for each contact, then the testing function for a specific electronic component contact layout is reliable, but the device complexity and production cost increase when testing components with different contact layouts
Solution Approach 1:
The patent applies the dynamics principle by making the electrical paths dynamically reconfigurable through switches. Each conductor can be switched between different connection states (direct connection, ground connection, or buffer connection), allowing the same physical probe to adapt its electrical configuration to match different electronic component contact layouts, thereby reducing the need for multiple specialized probes
Solution Approach 2:
The patent implements parameter changes by modifying the electrical connection state of each conductor through switch positions. The switches can change the resistance, capacitance, and connectivity parameters of the electrical paths, enabling the probe to transform from a fixed-configuration device to a reconfigurable one that can test various component types
2Measurement precision
If separate wafer probes are produced for each electronic component contact layout, then the measurement precision for each specific layout is optimized, but the manufacturing cost increases
Solution Approach 1:
The patent applies universality by designing a single wafer probe that can serve multiple functions for testing different electronic component contact layouts. The reconfigurable switches enable each conductor to perform different electrical functions (signal transmission, ground reference, buffered connection) depending on the testing requirements, making one probe replace multiple specialized probes and reducing manufacturing costs
3Device complexity
If fixed electrical paths are used in the wafer probe, then the device structure is simple, but the adaptability to different electronic component contact layouts is reduced
Solution Approach 1:
The patent transforms the static electrical paths into dynamic, reconfigurable paths using switches. This allows the probe to adapt its electrical configuration to match different electronic component contact layouts while maintaining a relatively simple physical structure, resolving the contradiction between structural simplicity and functional adaptability
Data Source
AI summary
A device for measuring electronic components having a plurality of conductors applied to a dielectric cable carrier, which conductors are each connected both to a contact finger and to a connection contact, such that a switch is integrated in at least one of the conductors, via which the conductor can be additionally connected to a ground connection.