Wafer Temperature Detection System Using Probe-Based Sensing Modules
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Solution Overview
Problem
Existing temperature detection systems on wafers are limited by the need for increased wiring, which constrains the data collection capacity and restricts the number of temperature sensors that can be effectively used, thereby reducing detection flexibility.
Innovation Solution
A temperature detection system comprising a wafer with dies, sensing modules adjacent to the dies, each equipped with a temperature sensor and pads, and a probe that transmits detection signals, allowing for increased sensor density and flexible detection regions without the need for extensive wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of temperature sensors on the wafer is increased, then the detection coverage is improved, but the wiring complexity and data collection capacity constraints increase
Solution Approach 1:
The patent segments the wafer into multiple regions with multiple dies, and places temperature sensors on individual dies or adjacent to them. Each sensing module is independently configured with pads that can be contacted by probes, eliminating the need for extensive wiring across the entire wafer. This segmentation allows numerous sensors to be distributed throughout the wafer without requiring a complex centralized wiring system.
Solution Approach 2:
The patent introduces probes as an intermediary between the sensing modules on the wafer and the data collection system. Instead of directly wiring each sensor to a central module, the probes serve as temporary contact points that read data from the pads during testing. This intermediary approach significantly reduces wiring complexity while maintaining the ability to collect data from multiple sensors simultaneously.
2Area of stationary object
If the number of temperature sensors is increased, then the detection region is expanded, but the data collection capacity is constrained
Solution Approach 1:
The patent employs a dynamic probing system where the probe card can be positioned and contacted with specific sensing modules as needed. This dynamic approach allows the system to adaptively select which sensors to read at any given moment, enabling data collection from multiple sensors across expanded detection regions without being constrained by fixed wiring capacity. The system can dynamically allocate data collection resources to match the detection requirements.
3Quantity of substance
If wiring is increased to connect more sensors, then more data can be collected, but the layout space is consumed
Solution Approach 1:
The patent extracts the wiring function from the permanent wafer structure and replaces it with temporary probe contacts. The pads on the sensing modules contain the electrical connection points, and the probes provide the necessary electrical connection during testing without requiring permanent wiring to be laid out on the wafer. This extraction of the connection function eliminates the layout space that would otherwise be consumed by extensive wiring while still enabling data collection from multiple sensors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables a significant increase in the number of temperature sensors on a wafer, expands the detectable region, and enhances detection flexibility by optimizing the layout to save wiring space while maintaining high data collection capabilities.
Implementation Method 1
each of the sensing modules includes a temperature sensor and a plurality of pads. The pads are electrically connected to the temperature sensor
Data Source
AI summary
A temperature detection system including a wafer, a plurality of sensing modules, and a probe is provided. The wafer has a plurality of dies. The sensing modules are adjacent to the dies, and each of the sensing modules includes a temperature sensor and a plurality of pads. The pads are electrically connected to the temperature sensor. The sensing modules transmit detection signals through the probe.