Wafer Probe Layout Using Grounded Probe Card and Vertical Wafer Handling

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Solution Overview

Problem

Conventional wafer probing systems face challenges in handling large and heavy probe heads, with inconsistent configurations that pose risks during handling and maintenance, and accumulate debris due to friction, leading to potential damage and inefficiencies in the testing process.

Innovation Solution

A wafer probe device featuring a holder and a probe card positioned on the ground, with a transportation module that rotates the wafer to a vertical state and uses an electrostatic chuck for secure holding, allowing the wafer to be moved upward for probing, reducing the risk of damage and debris accumulation by allowing fragments to fall away due to gravity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the probe head diameter is increased to handle large amount of chips, then the probing capability is improved, but the weight increases making handling and maintenance difficult

Engineering Contradiction:

Improveprobing capabilityVSAvoidprobe head weight

Core Design Contradiction:

Adaptability or versatilityVSWeight of moving object

Solution Approach 1:

The patent inverts the conventional probing configuration by placing the probe card on the ground and having the wafer move downward to contact it, rather than having the probe head move upward. This inversion allows the heavy probe card to remain stationary on the ground, eliminating the need to handle and reposition heavy probe heads during maintenance while maintaining the capability to test large wafers with extensive chip arrays.

Inventive Principle:

Principle #13The other way round (Inversion)

2Ease of manufacture

If manual locking of probe head on inner ring is used, then the setup process is simple, but the configuration is inconsistent with human factors engineering and creates handling risks

Engineering Contradiction:

Improvesetup simplicityVSAvoidhandling safety

Core Design Contradiction:

Ease of manufactureVSEase of operation

Solution Approach 1:

The patent replaces the manual mechanical locking process with an automated positioning system. The wafer is automatically positioned and contacted with the probe card through controlled movement, eliminating the need for manual manipulation of heavy probe heads and reducing ergonomic risks while maintaining setup simplicity through automated processes.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If the probe head is positioned above the wafer, then the testing can be conducted, but debris from friction accumulates on the wafer causing risk of probe striking

Engineering Contradiction:

Improvetesting capabilityVSAvoiddebris accumulation

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent inverts the relative positioning by placing the probe card on the ground and having the wafer move downward to contact it. This inversion causes friction debris to fall away from the wafer surface due to gravity, preventing accumulation on the wafer and eliminating the risk of probe striking, while maintaining full testing capability.

Inventive Principle:

Principle #13The other way round (Inversion)

4Ease of repair

If mechanical apparatus is required to move the probe apparatus for maintenance, then the maintenance can be performed, but additional complexity and re-setting time are required

Engineering Contradiction:

Improvemaintenance accessibilityVSAvoidmechanical apparatus complexity

Core Design Contradiction:

Ease of repairVSDevice complexity

Solution Approach 1:

The patent replaces the need for additional mechanical apparatus to move the probe head with a stationary probe card configuration. The probe card remains fixed on the ground, and maintenance can be performed without requiring complex positioning mechanisms, reducing device complexity and eliminating re-setting time while maintaining maintenance accessibility.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves probing efficiency and safety by simplifying the setup mechanism, reducing the risk of probe striking, and enhancing the quality of the wafer testing process by allowing direct observation and reducing mechanical complexity.

Implementation Method 1

uses an electrostatic chuck for secure holding

Methodology Applied

Scientific EffectElectrostatic attraction: Electrostatics

Implementation Method 2

allowing fragments to fall away due to gravity

Methodology Applied

Scientific EffectGravity: Gravitation

Data Source

PatentUS11796566B2Wafer probe device

Publication Date: 2023.10.24 WINBOND ELECTRONICS CORP

AI summary

A wafer probe device is provided, including a holder and a probe card. The holder is configured to hold a wafer. The probe card is disposed on the ground, between the holder and the ground, and under the holder. The probing side of the probe card faces away from the ground. The holder moves the wafer toward the probe card, and a probed surface of the wafer contacts the probe card.