Multi-Axis Wafer Prober for Complex Die Orientation Testing
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Solution Overview
Problem
Existing wafer probers struggle to efficiently test wafers with semiconductor components arranged in complex configurations, including variable orientations and spacings, due to limited flexibility and efficiency in measurement.
Innovation Solution
A wafer prober with a modular design featuring multiple measuring units and five degrees of freedom (X, Y, Z, θ, φ) allows for precise and flexible testing of wafers with complex component arrangements, using interchangeable probe cards and rotational degrees of freedom to correct angular and non-planarity errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional wafer probers with fixed measuring units are used, then the device structure is simple, but it cannot efficiently test wafers with complex component configurations including variable orientations and spacings
Solution Approach 1:
The measuring units are made dynamically adjustable with five degrees of freedom (X, Y, Z translations and θ, φ rotations), allowing real-time adaptation to complex component configurations on the wafer surface, transforming a static fixed-structure system into a dynamic multi-axis adjustable system
Solution Approach 2:
The measuring units are designed as multi-functional modules capable of performing various measurement tasks on different component types and configurations through interchangeable probe cards and five-degree-of-freedom motion capabilities, enabling a single device to handle diverse testing requirements
2Productivity
If sequential testing of components is performed with fixed measuring units, then the device complexity is low, but the test time increases significantly
Solution Approach 1:
Multiple measuring units with five degrees of freedom are integrated into a single coordinated system, combining their capabilities to perform parallel or optimized sequential measurements across the wafer surface, reducing total test time while maintaining measurement precision
Solution Approach 2:
The system performs preliminary positioning and orientation adjustments using the five degrees of freedom before actual measurement, pre-configuring the measuring units to optimal positions to minimize measurement time and enable faster sequential testing
3Measurement precision
If measuring units without rotational degrees of freedom are used, then the device structure is simple, but measurement accuracy decreases for components with variable orientations
Solution Approach 1:
Rotational degrees of freedom (θ and φ) are added to the measuring units, enabling dynamic angular adjustment to match the orientation of components on the wafer, transforming a static single-orientation measuring system into a dynamic multi-orientation capable system
Solution Approach 2:
The measuring units can change their orientation parameters (angular positions θ and φ) to adapt to different component orientations on the wafer, allowing precise measurement alignment with components regardless of their rotational arrangement
Data Source
AI summary
A wafer prober includes a support structure defining a first upper guide and a first lower guide parallel to a first horizontal axis and vertically overlapping with each other, measuring units that each include a first carriage sliding along a first guide, a second guide carried by the first carriage and parallel to a second horizontal axis orthogonal to the first axis, a second carriage sliding along the second guide, and a movable terminal assembly carried by the second carriage, and a measuring head carried by the movable terminal assembly and provided with needle contacts that interact with points of the wafer. The movable terminal assembly is configured to move the measuring head according to a linear degree of freedom along a vertical axis and at least one rotational degree of freedom about the vertical axis. The wafer prober includes a control unit that controls the measuring units independently.