Wafer Prober Power Calibration Adapter
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Solution Overview
Problem
The cumbersome process of recalibrating wafer probers disrupts production by requiring significant downtime, as traditional calibration methods cannot account for time-variant parameters like wear and environmental changes, relying on inaccurate S-Parameters instead of actual measurements.
Innovation Solution
A power calibration adapter with first and second landing pads, coupled to a power meter interface, allows for direct calibration of wafer prober tips, using calibration standards to determine error terms and perform real-time power calibrations, eliminating the need for S-Parameters and enabling quick recalibration without removing the tips from the measurement setup.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional calibration methods using S-Parameters are used, then calibration can be performed without direct measurement, but measurement precision deteriorates because S-Parameters do not account for time-variant parameters like wear and environmental changes
Solution Approach 1:
The patent implements a 1-port calibration procedure that is performed beforehand to determine error terms specific to each wafer prober tip. These error terms are stored and later used to correct power measurements, eliminating the need for frequent recalibration while maintaining high measurement precision. The preliminary calibration captures the actual electrical characteristics of each tip rather than relying on generic S-Parameters.
Solution Approach 2:
The system incorporates a feedback mechanism where power measurements are corrected using the previously determined error terms. The power measurement device uses these error terms to compensate for time-variant parameters such as wear and environmental changes, continuously maintaining measurement accuracy without requiring manual recalibration intervention.
2Reliability
If traditional calibration with S-Parameters is used, then device complexity is reduced, but reliability deteriorates because it cannot account for wear and environmental changes
Solution Approach 1:
The patent introduces an intermediary calibration layer between the power measurement device and the wafer prober tips. The 1-port calibration procedure acts as an intermediary that characterizes each tip's electrical properties and creates error terms. This intermediary step bridges the gap between the measurement system and the varying tip conditions, improving reliability without requiring complex real-time monitoring of wear and environmental factors.
3Measurement precision
If wafer prober tips are removed for recalibration, then measurement precision can be maintained, but productivity deteriorates due to production stoppage
Solution Approach 1:
The system performs 1-port calibration as a preliminary action during which the wafer prober tips remain in place. The calibration standards are brought to the tips rather than removing the tips for calibration. This approach maintains measurement precision while avoiding production stoppage, as the tips stay mounted and can return to production immediately after calibration.
4Measurement precision
If complex recalibration processes are implemented, then measurement precision improves, but ease of operation deteriorates
Solution Approach 1:
The calibration system is designed to be self-service through automation. The 1-port calibration procedure is automatically executed using stored error terms, eliminating the need for manual calibration operations. The system self-corrects power measurements using the predetermined error terms, maintaining high measurement precision while greatly simplifying operation. Users simply initiate the calibration sequence without needing to understand or perform complex calibration steps.
Data Source
AI summary
The present disclosure provides a power calibration adapter for wafer probers, the power calibration adapter comprising at least one first landing pad, for releasably contacting a wafer prober tip of the wafer prober, and a power meter interface for each one of the first landing pads that is coupled to the at least one first landing pad and that is configured to couple the at least one first landing pad to a power measurement device. Further, the present disclosure provides a respective Zo measurement application system and a respective method.