Wafer Probing Receiver Alignment Using Profile Sensor Measurement
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Solution Overview
Problem
Conventional wafer probing systems face inefficiencies in aligning the receiver center of an inhomogeneous receiver with the emitter center, leading to prolonged alignment times and inaccurate determination of the measuring range, requiring repeated alignment procedures with each new probe card.
Innovation Solution
A method involving the use of a profile sensor to measure the receiver center position, a reference tip position on a probe card, and aligning the receiver based on the relative positions to achieve precise alignment with the anisotropic emitter, allowing for simultaneous testing of multiple semiconductor dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the conventional searching trajectory method is used to align the receiver center with the emitter center, then the alignment can be completed, but it wastes too much time and the real receiver center cannot be accurately determined
Solution Approach 1:
The patent applies preliminary action by measuring and recording the receiver center position before the alignment procedure begins. The profile sensor captures the receiver's positional characteristics in advance, storing this data for later use during alignment. This eliminates the need for time-consuming searching trajectories during actual alignment, as the receiver center is already known from the preliminary measurement.
Solution Approach 2:
The patent replaces the mechanical searching trajectory method with an optical measurement system. Instead of physically moving the receiver along a searching path to find the optimal position, the system uses a profile sensor to optically measure and calculate the receiver center position directly, substituting mechanical exploration with optical detection and computational analysis.
2Measurement precision
If the optimal alignment point is calculated through searching trajectory, then alignment can be achieved, but it is difficult to determine the difference between real receiver center and optimal one
Solution Approach 1:
The patent implements feedback by continuously monitoring and recording the receiver center position using the profile sensor throughout the alignment process. The system compares the measured receiver center position with the calculated optimal alignment point, providing feedback information about the positional difference. This allows for real-time verification and adjustment, ensuring accurate alignment while maintaining knowledge of the receiver's actual position.
3Reliability
If the receiver is displaced to the optimal alignment point through conventional method, then alignment is achieved, but it requires repeated alignment procedures when probe card is replaced
Solution Approach 1:
The patent applies universality by creating a general method for determining receiver center position that can be applied to any probe card replacement scenario. The profile sensor-based measurement approach and the calculated receiver center position are universal to the receiver device itself, independent of the specific probe card being used. This allows the same alignment information to be reused across multiple probe cards, eliminating the need for repeated alignment procedures.
Data Source
AI summary
A method for aligning an inhomogeneous receiver with an anisotropic emitter on a wafer probing system, wherein a reference semiconductor die comprising a reference pad and an anisotropic emitter is formed on a semiconductor wafer, the reference pad is located at a reference-pad-and-anisotropic-emitter relative position corresponding to the anisotropic emitter, the method comprises following steps of: measuring a receiver center position of an inhomogeneous receiver configured on a wafer probing system by a profile sensor; measuring a reference tip position of a reference tip of a reference probe on a probe card by a measuring instrument; displacing the inhomogeneous receiver in an aligning displacement according to the reference-pad-and-anisotropic-emitter relative position, the reference tip position and the receiver center position; and aligning the reference tip with the reference pad by a probe-tip-and-pad aligning machine of the wafer probing system.