Sector-Shaped Wafer Processing with Adaptive Feed Control
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Solution Overview
Problem
The processing time for dividing sector-shaped wafer pieces into quarters is not efficiently shortened, as existing methods do not allow for optimal processing feed quantity adjustments based on the shape of the quarter wafer pieces.
Innovation Solution
A method that involves collecting information on the shapes of quarter wafer pieces, aligning them using an imaging unit, and selecting the appropriate processing feed quantity for each pattern to optimize processing, allowing for efficient division along the division lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If quarter wafer pieces are processed with a fixed processing feed quantity, then the processing apparatus operates with standardized parameters, but the processing time cannot be shortened for different shapes
Solution Approach 1:
The processing feed quantity is made dynamic and adaptable based on the detected shape of the quarter wafer piece. The system automatically adjusts the processing feed quantity according to the specific shape pattern (first, second, third, or fourth pattern) of each quarter wafer piece, rather than using a fixed feed quantity for all pieces. This enables optimal processing speed for each shape variant.
Solution Approach 2:
The system incorporates a shape detection mechanism that detects the shape of each quarter wafer piece before processing. Based on the detected shape, the system provides feedback to select the appropriate processing feed quantity from pre-stored values corresponding to different shape patterns. This closed-loop feedback system ensures the processing parameters match the actual workpiece geometry.
2Measurement precision
If specialized shape recognition equipment is used to detect wafer orientation, then detection accuracy is improved, but device complexity and cost increase
Solution Approach 1:
The imaging unit, which is part of the existing processing apparatus, is utilized for dual purposes: both for imaging the quarter wafer piece during alignment and for detecting the shape/orientation of the wafer. This eliminates the need for a separate, specialized shape recognition equipment, reducing system complexity while maintaining detection accuracy.
Solution Approach 2:
The imaging unit serves multiple functions including alignment imaging and shape detection. By using the existing imaging capability of the processing apparatus for both alignment and shape recognition, the system avoids adding specialized detection equipment, thereby reducing overall device complexity while maintaining measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables automatic detection of wafer orientation and optimization of processing feed quantity without the need for specialized shape recognition equipment, improving processing efficiency.
Implementation Method 1
a holding step of suction holding the quarter wafer piece of the wafer unit by a chuck table of a processing apparatus through the dicing tape
Data Source
AI summary
A sector-shaped wafer piece is processed according to the shape of the piece obtained by dividing a wafer into quarters. Information is collected on the shapes of four patterns of the quarter wafer pieces different in the position of a circular arc of an outer periphery and on processing feed quantities corresponding to the shapes of the four patterns. A pattern is selected by calculating a region of a square having vertical and horizontal sides equal to the two sides of the quarter wafer piece, imaging each of the sides to search for the presence/absence of a target pattern, and selecting that one of the four patterns to which the held quarter wafer piece corresponds. The held quarter wafer piece is processed along division lines with a processing feed quantity corresponding to the selected pattern.