Wafer Processing Method for Large Diameter Semiconductor Substrates
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Solution Overview
Problem
Processing large-diameter semiconductor wafers using existing equipment is costly due to the need for new systems, as existing equipment is not compatible with larger diameters, leading to high equipment costs.
Innovation Solution
A wafer processing method that involves providing a protective member on the wafer, cutting it into quarters, grinding the back side, and then using existing dicing and grinding apparatuses to divide the quarters into individual devices, allowing existing equipment to be utilized efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a new processing apparatus conforming to 450 mm wafer is constructed, then the large-diameter wafer can be processed, but equipment costs become very high
Solution Approach 1:
The large-diameter wafer is divided into four smaller wafer quarters through preliminary cutting along division lines extending in first and second directions. This segmentation allows the wafer quarters to be processed using existing equipment designed for smaller wafers, avoiding the need to construct expensive new processing apparatus conforming to 450 mm wafers while still enabling large-diameter wafer processing
Solution Approach 2:
An annular frame is introduced as an intermediary component to hold the wafer quarters during processing. The frame having an opening capable of accommodating the wafer quarter serves as a mediator that adapts the wafer quarter to fit existing processing equipment, enabling compatibility between large-diameter wafer sources and smaller-diameter processing apparatus
2Ease of manufacture
If existing equipment for 300 mm wafer is used, then equipment costs are reduced, but it cannot process 450 mm wafer directly
Solution Approach 1:
The 450 mm wafer is cut into four smaller quarters that can fit into existing 300 mm equipment. This segmentation transforms the incompatibility issue by creating smaller processable units from the large wafer, allowing existing equipment to process portions of the large-diameter wafer without requiring new apparatus
Solution Approach 2:
The wafer is pre-cut into quarters before being placed in the annular frame for processing. This preliminary action of dividing the wafer into manageable sections enables the use of existing smaller equipment, as the cutting and framing operations are performed in advance to create compatibility with available processing apparatus
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the division of large-diameter wafers into individual devices using existing equipment, reducing the need for new systems and saving equipment costs by utilizing existing dicing and grinding apparatuses for smaller diameter wafers.
Implementation Method 1
a wafer quarter generating step of cutting the wafer along the division line extending in the first direction through the center of the wafer and along the division line extending in the second direction through the center of the wafer
Implementation Method 2
a back grinding step of grinding the back side of each wafer quarter to reduce the thickness of the wafer quarter
Implementation Method 3
attaching an adhesive tape to the annular frame and the back side of the wafer quarter
Data Source
AI summary
A wafer processing method includes: a protective member providing step of providing a protective member on the front side of a wafer; a wafer quarter generating step of cutting the wafer along the division line extending in a first direction through the center of the wafer and along the division line extending in a second direction perpendicular to the first direction through the center of the wafer, thereby generating four sectorial wafer quarters; a back grinding step of grinding the back side of each wafer quarter to reduce the thickness of the wafer quarter; a frame providing step of supporting the wafer quarter through an adhesive tape to an annular frame; and a wafer quarter dividing step of fully cutting the wafer quarter along all of the division lines extending in the first and second directions, thereby dividing the wafer quarter into the individual devices.