Wafer Processing Device with Movable Support Table for Film Peeling and Bar Code Adhesion
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Solution Overview
Problem
In semiconductor manufacturing, the reduction in wafer thickness due to back-grinding causes the wafer to undulate when changing support tables, leading to errors in reading character information and adhering bar codes, resulting in lower yield and increased working time.
Innovation Solution
A workpiece processing device with a movable support table that allows for both surface protection film peeling and bar code adhering operations to be performed without moving the workpiece, preventing undulation and ensuring accurate reading and adherence of bar codes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the wafer is conveyed to a different table after surface protection film peeling, then the workpiece can be processed in sequence, but the dicing tape and wafer undulate causing reading and adhering failures
Solution Approach 1:
The patent combines the surface protection film peeling operation and bar code adhering operation into a single integrated process step performed on the same table. This merging eliminates the need to transfer the workpiece between tables, thereby preventing undulation while maintaining sequential processing capability.
Solution Approach 2:
The patent introduces a removable table as an intermediary device that can be selectively installed or removed. When the removable table is installed, it provides additional support to prevent undulation of the dicing tape and wafer during the combined peeling and adhering operations, thus maintaining reading accuracy.
2Adaptability or versatility
If the support table is changed after surface protection film peeling, then different processing operations can be performed, but bar code adhering becomes difficult
Solution Approach 1:
The patent merges the surface protection film peeling operation and bar code adhering operation into a single integrated process step performed on the same table. This eliminates the need to change tables between operations, making bar code adhering easier while preserving processing flexibility through the removable table mechanism.
Solution Approach 2:
The removable table acts as an intermediary that provides stable support during bar code adhering operations. By installing the removable table, the system maintains a stable working surface that facilitates easy bar code adhering while still allowing table configuration changes for different processing needs.
3Productivity
If the dicing tape and wafer undulate, then table change enables different operations, but optical reading cannot accurately read character information
Solution Approach 1:
The patent combines surface protection film peeling and bar code adhering into a single operation on the same table, eliminating table changes and preventing undulation. This ensures accurate optical reading of character information while maintaining operational efficiency.
Solution Approach 2:
The removable table serves as an intermediary support structure that prevents undulation of the dicing tape and wafer during operations. By providing additional stable support, it enables accurate optical reading of character information while still allowing table reconfiguration for different processing operations.
Data Source
AI summary
A workpiece processing device (10) for processing a workpiece (60; 20, 36) comprises: a surface protection film peeling means (50) for peeling a surface protection film (110), which is adhered to a front surface (21) of a workpiece, with a peeling tape (4); a bar code adhering means (11) for adhering a bar code (65) corresponding to the workpiece to the workpiece; and a movable support table (72) for supporting the workpiece. A peeling operation for peeling the surface protection film conducted by the surface protection film peeling means and a adhering operation for adhering a bar code conducted by the bar code adhering means are given to the workpiece while the workpiece is being supported by the support table. Due to the foregoing, it is possible to avoid failures when adhering the bar code to the workpiece, such as a wafer. The bar code adhering means may adhere the bar code, which corresponds to character information of the workpiece read out by an optical reading means, to the workpiece.