Semiconductor Wafer Processing Apparatus Variable Lot Adaptation

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Solution Overview

Problem

Batch-type semiconductor processing equipment faces challenges in processing wafers with variable numbers of lots due to differences in process settings, leading to inappropriate processing without a table specifying lot numbers and monitoring wafer usage.

Innovation Solution

A semiconductor wafer processing apparatus comprising an operator interface, equipment management server, and device interface server that receives batch information to derive and set process conditions, enabling adaptation to variable wafer lots and monitoring wafer usage, with methods for updating and setting sub-recipes and process recipes in processing equipment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If batch-type semiconductor processing equipment processes wafers with variable numbers of lots without a specification table, then the equipment can handle different batch sizes, but inappropriate processing occurs due to incorrect process settings

Engineering Contradiction:

Improveability to process variable batch sizesVSAvoidprocessing accuracy

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The system pre-establishes a specification table that defines correct process settings for different batch sizes (1-6 lots) and monitoring wafer configurations. Before processing begins, the system retrieves and applies the appropriate pre-defined settings based on the actual batch composition, ensuring reliability while maintaining adaptability to variable batch sizes.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent introduces an intermediary specification table that acts as a mediator between the variable batch inputs and the fixed process requirements. This table stores pre-configured process parameters that bridge the gap between different batch scenarios, allowing the equipment to adapt to various lot numbers while maintaining consistent, reliable processing through standardized intermediate settings.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If process settings are customized for each batch size to ensure accurate processing, then processing accuracy improves, but system complexity increases due to multiple configuration tables

Engineering Contradiction:

Improveprocess setting accuracyVSAvoidconfiguration table structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The specification table is designed as a universal data structure that handles multiple processing scenarios (different lot numbers 1-6, with or without monitoring wafers) within a single unified framework. This multi-functional table eliminates the need for separate configuration tables for each scenario, achieving manufacturing precision through comprehensive coverage while reducing system complexity by consolidating configurations.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If monitoring wafer inspection is performed for every batch to ensure quality control, then defect detection improves, but processing time increases due to additional inspection steps

Engineering Contradiction:

Improvequality control accuracyVSAvoidprocessing cycle time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The system implements selective monitoring where a dedicated monitoring wafer is processed alongside the batch only when required for quality control, rather than inspecting every wafer individually. This partial action approach maintains reliable quality control for the entire batch through representative sampling, while reducing total inspection time compared to examining each wafer separately.

Inventive Principle:

Principle #16Partial or excessive action

Data Source

PatentUS7353078B2Semiconductor wafer processing apparatus and method for processing batch of wafers having variable number of wafer lots

Publication Date: 2008.04.01 SAMSUNG ELECTRONICS CO LTD

AI summary

Disclosed is a semiconductor processing apparatus for processing batches of wafers with variable numbers of wafer lots. The apparatus includes an operator interface server adapted to receive batch information for a track-in operation, an equipment management server adapted to store data used to process the batch of wafers, and a device interface server adapted to control a selected unit of processing equipment used to process the batch of wafers. The batch information is transmitted from the operator interface server to the device interface server, and the device interface server attempts to set a sub-recipe in the selected unit of processing equipment based on the batch information. After the sub-recipe is set in the selected unit of processing equipment, the device interface server then attempts to set a process recipe in the device interface server.