Wafer Assemblies With Projections For Backplane Crosstalk Reduction
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Solution Overview
Problem
Backplane connector systems face challenges in increasing terminal density and operating speed while preventing interference and crosstalk in high-density electronic components.
Innovation Solution
The system employs wafer assemblies with projections and ground shielding structures to encapsulate electrical connector pairs in a three-dimensional manner, using dielectric fillers to prevent mode propagation and incorporating projections to block line-of-sight between signal contacts, thereby reducing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the spacing between electrical terminals is reduced to increase terminal density, then the number of electrical terminals per unit area increases, but crosstalk and interference between adjacent terminals worsen
Solution Approach 1:
The patent introduces ground shielding structures that extend in the vertical dimension between signal terminals. These ground shields create a three-dimensional shielding arrangement that blocks electromagnetic field coupling between adjacent signal terminals, thereby reducing crosstalk while maintaining high terminal density in the horizontal plane.
Solution Approach 2:
Ground shielding structures serve as intermediary elements positioned between signal terminals. These ground shields act as electromagnetic field barriers that mediate the interaction between adjacent signal terminals, preventing direct field coupling and reducing interference without requiring increased spacing between signals.
2Object-affected harmful factors
If ground shielding structures are added to reduce crosstalk, then interference between signal terminals decreases, but device complexity increases
Solution Approach 1:
The ground shielding structures are merged with the housing structure of the electrical connector. The ground shields are integrated into the housing as integral features rather than separate components, which reduces assembly steps and simplifies manufacturing while maintaining the crosstalk reduction functionality.
Solution Approach 2:
The housing structure serves multiple functions: it provides mechanical support, defines the connector geometry, and incorporates ground shielding features. This multi-functionality reduces the need for separate ground shield components and simplifies the overall device structure while maintaining electromagnetic interference protection.
3Quantity of substance
If more electrical terminals are housed in the connector system, then terminal density increases, but the spacing between terminals must be reduced which increases difficulty of manufacturing
Solution Approach 1:
The connector system is segmented into modular wafer assemblies that can be manufactured separately and then assembled. Each wafer assembly contains a subset of electrical terminals with standardized pitch, allowing for precise manufacturing of individual modules that are then combined to create high-density connector systems without requiring ultra-precise manufacturing of the entire assembly at once.
Data Source
AI summary
An electrical connector system may include a plurality wafer assemblies that engage with a substrate. Each wafer assembly includes a housing that defines a plurality of projections extending from an edge of the housing at a mounting end of the wafer assembly. At least a portion of a projection of the plurality of projections of the housing is dimensioned to fit into a corresponding hole in a substrate when the housing is engaged with the substrate. In some implementations, the projection is positioned on the housing to block a line-of-sight between a first signal substrate engagement element of an array of electrical contacts associated with the housing and a second signal substrate engagement element of the array of electrical contacts.