Wafer Protective Resin Layout for Peel-Safe Grinding
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Solution Overview
Problem
The existing protective component formation methods result in the protective component peeling off during wafer grinding, leading to damage and non-uniform thickness due to varying bonding forces, making it difficult to remove the component post-grinding.
Innovation Solution
A protective component formation apparatus and method using a combination of first and second liquid resins with differing bonding forces, where the first resin with high bonding force is applied to the outer circumferential part and the second resin with lower bonding force is applied to the inner part, allowing easy peeling post-grinding while maintaining uniform thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding force of the protective component is increased to prevent peeling during grinding, then the protective component remains firmly attached during processing, but it becomes difficult to peel the protective component off from the wafer after grinding
Solution Approach 1:
The patent applies different bonding strength characteristics to different regions of the protective component. The outer circumferential region uses a first protective component material with higher bonding force to prevent peeling during grinding, while the inner region uses a second protective component material with lower bonding force to facilitate easy removal after processing. This spatial differentiation of material properties resolves the contradiction between maintaining reliability during processing and enabling ease of manufacture afterward.
2Device complexity
If a single uniform resin material is used for the protective component, then the manufacturing process is simple, but the protective component peels off at the outer circumferential part during grinding causing wafer damage
Solution Approach 1:
The patent divides the protective component into two distinct regions with different material properties. The outer circumferential part uses a resin material with high bonding force to prevent peeling during grinding operations, while the inner part uses a resin material with lower bonding force. This local differentiation of material quality resolves the contradiction by providing enhanced stability where needed during processing while maintaining overall component functionality.
Solution Approach 2:
The patent employs a composite structure for the protective component, combining two different resin materials with distinct bonding characteristics. The first resin material (outer region) provides strong adhesion to prevent peeling during grinding, while the second resin material (inner region) offers appropriate bonding strength for normal operation and facilitates post-processing removal. This composite approach resolves the contradiction between simplicity and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents peeling of the protective component during grinding, ensures easy removal post-grinding, and results in a wafer with reduced warpage and uniform thickness.
Implementation Method 1
When the liquid resin is UV-curing resin, the UV-curing resin is cured by applying UV light to the UV-curing resin
Data Source
AI summary
A protective component formation apparatus includes: a spreading table; a holding table which holds a wafer; a first supplier configured to supply first liquid resin; a second supplier configured to supply second liquid resin having a lower bonding force than the first liquid resin; an elevation mechanism which is configured to spread the liquid resin by moving up and down the holding table and the spreading table relative to each other in a vertical direction; a curer which is configured to cure the liquid resin having been spread; and a controller which is configured to supply the second liquid resin to a central part of the first liquid resin, to spread the first liquid resin and the second liquid resin over the of one surface of the wafer by the elevation mechanism and to cure the first liquid resin and the second liquid resin by the curer.