Ventilated Wafer Puck With Dustproof Labyrinth Venting
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Solution Overview
Problem
Existing semiconductor wafers' gas protection methods result in poor gas exchange due to puck deformation, leading to wafer surface contamination and imprints.
Innovation Solution
A ventilated puck design with a ventilation channel and dustproof labyrinth structure to improve gas exchange, preventing puck deformation and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the upper box and lower box are tightly fitted to form a sealed structure, then the containment of semiconductor wafers is improved, but gas exchange between interior and exterior deteriorates
Solution Approach 1:
The ventilation channel is segmented into multiple sections including a ventilation hole, a ventilation passage, and a dustproof labyrinth structure. This segmentation allows the system to simultaneously achieve gas exchange functionality and dustproof performance, resolving the contradiction between sealed containment and gas exchange efficiency.
2Strength
If the upper box and lower box are tightly fitted, then structural integrity is improved, but puck deformation during vacuuming and inflation worsens
Solution Approach 1:
The ventilation channel acts as an intermediary structure that connects the interior hollow space with the external environment. This intermediary allows pressure equalization during vacuuming and inflation processes, preventing the pressure differential that causes puck deformation while maintaining overall structural integrity.
3Productivity
If the ventilation channel is opened for gas exchange, then gas flow is improved, but dust contamination enters the hollow structure
Solution Approach 1:
The dustproof labyrinth structure functions as a porous barrier with multiple tortuous passages. This porous structure allows gas molecules to pass through while trapping dust particles, thereby achieving both high gas flow rate and effective dust contamination prevention.
4Object-affected harmful factors
If the ventilation channel includes a dustproof labyrinth structure, then dustproof performance is improved, but channel complexity increases
Solution Approach 1:
The ventilation channel merges multiple functions into a single integrated structure: gas intake, gas flow, and dust filtration are all accomplished within one continuous passage system. This merging approach achieves high dustproof performance without requiring multiple separate components, thus limiting the increase in overall complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances gas exchange, preventing wafer surface contamination by maintaining structural integrity during vacuuming and inflation processes.
Implementation Method 1
the constantly changing inner diameter dimension causes a constant change of the flow rate of the gas, so that the dust settles at a section which has larger inner diameter and slower flow rate
Implementation Method 2
the dust settles at a section which has larger inner diameter and slower flow rate, thereby achieving the dustproof purpose
Data Source
AI summary
A ventilated puck is provided. The ventilated puck includes an upper box, a spider plate, and a lower box. In particular, the upper box is fitted on the lower box to form a hollow structure, in which the spider plate is disposed. A ventilation channel for communicating the hollow structure with an external environment is provided in the upper box, or in the lower box or at interface between the upper box and the lower box. The ventilated puck of the present application may ensure gas exchange during the gas protection process conducted on semiconductor wafers, thereby preventing deformation of the puck due to pressure differences. Optionally, the interior of the ventilation channel is provided with a dustproof labyrinth structure, thereby preventing the entry of dust.