Wafer Container Purgeable Supporting Module
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Solution Overview
Problem
Conventional wafer containers face issues with insufficient supporting force, large contact area leading to particle generation, and inadequate gas flow, which can cause wafer damage and contamination during transportation.
Innovation Solution
A front opening unified pod (FOUP) with an inflatable supporting module featuring a long slit facing the opening for gas flow, vertically arranged supporting ribs, and restraint components to minimize contact area and prevent particle formation, while supporting larger wafers effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If a layer of resin is coated on supporting components to reduce friction and prevent particle generation, then particle generation is reduced, but the supporting force becomes insufficient and wafers droop or sink
Solution Approach 1:
The supporting module is segmented into multiple vertical supporting ribs arranged at intervals, where each rib provides localized support. This segmentation allows the load to be distributed across multiple contact points rather than a continuous surface, maintaining supporting force while reducing the total contact area that generates particles.
Solution Approach 2:
The supporting ribs are designed with specific local properties - vertical orientation and interval arrangement - to concentrate support force at discrete locations. This local quality approach provides sufficient supporting force at critical points while minimizing the overall contact area between the wafer and supporting components, thereby reducing particle generation.
2Object-generated harmful factors
If the contact area between supporting components and wafers is reduced to prevent particle generation, then particle generation is reduced, but the supporting force becomes insufficient for larger wafers
Solution Approach 1:
The supporting module is segmented into multiple vertical supporting ribs arranged at intervals, where each rib provides localized support. This segmentation allows the load to be distributed across multiple contact points rather than a continuous surface, maintaining supporting force while reducing the total contact area that generates particles.
Solution Approach 2:
The supporting ribs extend vertically along the wafer surface, utilizing the vertical dimension to provide support. This vertical arrangement allows the supporting force to be applied along the length of the wafer without requiring large horizontal contact areas, thus maintaining support capability while minimizing particle-generating contact surfaces.
3Device complexity
If conventional supporting modules are used without gas flow, then the structure is simple, but particles generated during transportation cannot be effectively removed
Solution Approach 1:
A gas inlet is integrated into the supporting module to introduce gas flow that passes over the wafer surface. This pneumatic approach uses gas flow to generate shear force that removes particles from the wafer surface during transportation, effectively addressing particle contamination without requiring complex mechanical cleaning mechanisms.
Solution Approach 2:
The supporting module with integrated gas inlet provides self-cleaning functionality through the gas flow that continuously acts on the wafer surface during transportation. The system serves itself by using the same gas flow that supports the wafer to simultaneously remove particles, eliminating the need for separate cleaning mechanisms.
4Object-generated harmful factors
If gas flow is increased to carry away particles effectively, then particle removal is improved, but the device complexity and energy consumption increase
Solution Approach 1:
The gas flow is directed locally over the wafer surface through the supporting module structure, concentrating the particle-removing action where it is most needed. This localized gas flow approach achieves effective particle removal without requiring high overall gas flow rates, thereby reducing energy consumption compared to uniform gas flow across the entire container.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced support for wafers, reduces particle generation, and improves the gas flow to effectively carry away particles, enhancing wafer yield and preventing contamination.
Implementation Method 1
an inflatable supporting module (200) is further respectively disposed between the pair of sidewalls (10L) and the back wall (10B')
Implementation Method 2
a long slit (205) is disposed on the inflatable supporting module (200) facing the direction of the opening (12) for gas flow
Data Source
AI summary
A wafer container includes a container body, formed by a pair of side walls, a top surface, and a bottom surface, on one sidewall of which is formed with an opening and on the other sidewall opposite to the opening is formed with a back wall, a supporting module being disposed on each of said sidewall for supporting a plurality of wafers; and a door joining with opening of the container body with its inner surface for protecting the plurality of wafers within the container body, the characteristic in that: a purgeable supporting module is respectively disposed between each side wall of the container body and the back wall, a long slot is further disposed on the side of purgeable supporting module facing the opening, and an air inlet is further disposed on one end of the purgeable supporting module for being connected to an gas valve, wherein the purgeable supporting module is formed by a plurality of supporting ribs vertically arranged at intervals.