Wafer Correction Mechanism With Common Reference Alignment

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Solution Overview

Problem

Existing wafer processing systems face challenges in maintaining precise robotic arm operations and integrating wafer direction correction with bar code reading, leading to increased costs and potential product damage due to inconsistent precision and angular misalignment.

Innovation Solution

A correction device and method that integrates an image capturing assembly and wafer locating mechanism with robotic arms to establish a common reference point, correcting the robotic arms' precision and angular alignment, and incorporates a single device for both bar code reading and wafer direction adjustment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple independent devices are used to correct wafer direction and read bar codes, then the functional completeness is improved, but the device volume and cost increase

Engineering Contradiction:

Improvefunctional completenessVSAvoiddevice volume

Core Design Contradiction:

Adaptability or versatilityVSVolume of stationary object

Solution Approach 1:

The patent combines the wafer direction correction function and bar code reading function into a single integrated device. The image capturing assembly serves dual purposes: capturing wafer images for direction correction and capturing bar code images for identification. This merging eliminates the need for separate independent devices, reducing device volume while maintaining complete functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The image capturing assembly is designed with multi-functionality, serving both as a wafer direction correction device and a bar code reader. The same imaging components and processing mechanisms are utilized for both functions, making the device universal and eliminating redundant components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple robotic arms are used to perform different operations, then the operational versatility is improved, but the precision consistency deteriorates due to lack of common reference point

Engineering Contradiction:

Improveoperational versatilityVSAvoidprecision consistency

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent introduces a common reference point as an intermediary element that all robotic arms use for positioning and orientation. This reference point serves as a mediator that ensures all robotic arms operate from the same coordinate system and angular基准, guaranteeing precision consistency across different operations while maintaining operational versatility.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The system employs feedback mechanisms where the positions and orientations of robotic arms are continuously monitored and adjusted relative to the common reference point. This feedback ensures that all robotic arms maintain precise and consistent positioning throughout their operations, eliminating drift and accumulation of errors.

Inventive Principle:

Principle #23Feedback

3Productivity

If wafer angular position is not corrected before processing, then the processing efficiency is improved by skipping the correction step, but the product quality deteriorates due to misalignment

Engineering Contradiction:

Improveprocessing efficiencyVSAvoidangular alignment precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent implements preliminary action by correcting the wafer angular position before the wafer enters the main processing sequence. The direction correction is performed in advance using image capture and computational algorithms, ensuring that when the wafer reaches the processing station, it is already properly aligned. This preliminary correction prevents quality issues while maintaining efficient processing flow.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS12532701B2Correction device for wafers and rotational drive mechanism of the wafers and correction method thereof

Publication Date: 2026.01.20 SUNG MAO YEN

AI summary

A correction device for wafers and rotational drive mechanism of the wafers and a correction method thereof. The correction device includes a first robotic arm, an image capturing assembly and a wafer locating member installation/uninstallation mechanism disposed on the first robotic arm. The correction device further includes a second robotic arm and a wafer taking/placing mechanism disposed on the second robotic arm. The first robotic arm drives the image capturing assembly and the wafer locating member installation/uninstallation mechanism to move to a main correction mechanism to correct the image capturing range and the operation position thereof. The second robotic arm drives the wafer taking/placing mechanism to move to the main correction mechanism to correct the operation position thereof. The wafer taking/placing mechanism moves the wafer to a wafer correction mechanism to read the data of the wafer and adjust the wafer to a true angular position.