Wafer Substrate Reinforcement Structure for Singulation Crack Prevention
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Solution Overview
Problem
Ensuring the reliability of wafer level packaging in semiconductor devices, particularly in the manufacturing process of semiconductor packages, where stress and crack issues arise during singulation due to non-uniform thickness caused by grooves, affecting yield and reliability.
Innovation Solution
Incorporating a reinforcement structure with a trunk portion and branch portions aligned with grooves on the wafer substrate, which compensates for thickness deficiencies and enhances structural rigidity during singulation, thereby alleviating crack issues and improving package reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If grooves are formed on the wafer substrate for optical device integration, then functionality is improved, but non-uniform thickness causes stress and crack issues during singulation
Solution Approach 1:
The reinforcement structure is formed on the wafer substrate before the singulation process. This preliminary structural enhancement provides mechanical support to compensate for the thickness non-uniformity caused by grooves, preventing stress concentration and crack formation during the subsequent singulation operation.
Solution Approach 2:
The reinforcement structure is formed using a material that is the same as or different from the wafer substrate material. This composite approach creates a hybrid structure where the reinforcement layer compensates for the structural weakness introduced by grooves, maintaining integrity during singulation while preserving optical device functionality.
2Productivity
If wafer level packaging is used for manufacturing efficiency, then productivity is improved, but stress concentration during singulation reduces yield
Solution Approach 1:
The reinforcement structure is prepared in advance on the wafer substrate before singulation. This pre-prepared structural support ensures that when batch singulation is performed for efficient manufacturing, each individual die maintains structural integrity, thereby maintaining both high productivity and singulation quality.
Solution Approach 2:
The reinforcement structure is positioned at specific locations on the wafer substrate where grooves are present and stress concentration is expected. This localized reinforcement maintains the overall wafer structure for efficient batch processing while providing targeted support to prevent cracks during singulation, ensuring high manufacturing precision.
3Adaptability or versatility
If grooves are etched to accommodate optical devices, then device functionality is improved, but structural uniformity deteriorates
Solution Approach 1:
The reinforcement structure is selectively positioned at locations corresponding to grooves on the wafer substrate. This localized approach restores thickness uniformity and structural stability specifically where grooves cause non-uniformity, while preserving the groove structure needed for optical device accommodation and functionality.
Solution Approach 2:
The reinforcement structure uses material that is the same as or different from the wafer substrate material to create a composite structure. This composite approach compensates for the thickness variation introduced by grooves, restoring structural uniformity while maintaining the functional grooves for optical devices.
Data Source
AI summary
A package includes a first die, a second die, a semiconductor frame, and a reinforcement structure. The first die has a first surface and a second surface opposite to the first surface. The first die includes grooves on the first surface. The second die and the semiconductor frame are disposed side by side over the first surface of the first die. The semiconductor frame has at least one notch exposing the grooves of the first die. The reinforcement structure is disposed on the second surface of the first die. The reinforcement structure includes a first portion aligned with the grooves.