Wafer Support Structure with Release Layer for Detachment
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Solution Overview
Problem
Existing semiconductor package stacking technologies face challenges in preventing warpage and electrical shorts due to the detachment process, particularly when removing the supporting substrate from the wafer, which can damage conductive bumps and lead to failures in the stacking process.
Innovation Solution
A wafer supporting structure comprising a supporting substrate, a release layer, and adhesive layers is used, where the release layer is positioned between the supporting substrate and the adhesive layers to facilitate detachment without direct contact with the conductive bumps, and the adhesive layers are configured to fully cover and support the bumps, preventing collapse and electrical shorts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the supporting substrate is directly attached to the wafer using adhesive layers, then the wafer can be firmly supported during stacking, but the detachment process causes warpage and electrical shorts due to direct contact with conductive bumps
Solution Approach 1:
A release layer is introduced as an intermediary between the adhesive layer and the supporting substrate. This release layer allows the adhesive to bond the wafer to the substrate during stacking while enabling clean detachment afterward by preventing direct adhesive contact with the conductive bumps, thus avoiding electrical shorts and warpage
Solution Approach 2:
The bonding interface is segmented into multiple functional layers: the adhesive layer provides bonding strength, the release layer provides detachment capability, and the supporting substrate provides mechanical support. This segmentation allows each layer to perform its specific function without interfering with others, particularly protecting the conductive bumps during detachment
2Object-affected harmful factors
If adhesive layers are applied to cover the conductive bumps, then the bumps are protected during detachment, but the adhesive may damage or contaminate the bumps during the bonding process
Solution Approach 1:
The release layer acts as a mediator that prevents adhesive direct contact with conductive bumps. The adhesive bonds to the release layer instead, which then bonds to the substrate, creating a protective barrier that shields the bumps from adhesive contamination and mechanical damage during both bonding and detachment
Solution Approach 2:
Different regions of the wafer surface have different functional requirements: areas with conductive bumps require protection and non-contact during bonding, while areas without bumps require strong adhesive bonding. The release layer provides this localized differentiation by being present only where bumps are located, allowing adhesive to bond freely in other regions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents warpage and electrical shorts during the stacking and detachment processes, ensuring reliable semiconductor package manufacturing by suppressing damage to conductive bumps and enabling straightforward detachment of the supporting substrate with minimal physical force.
Implementation Method 1
an adhesive layer for attaching the wafer to the supporting substrate
Implementation Method 2
a release layer for detaching the wafer from the supporting substrate
Data Source
AI summary
A wafer supporting structure includes a supporting substrate for supporting a wafer, a release layer for detaching the wafer from the supporting substrate, and an adhesive layer for attaching the wafer to the supporting substrate.