Wafer Resin Coating Thickness Control via Dynamic Holder Adjustment
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Solution Overview
Problem
Existing methods for coating wafers with resin often result in uneven thickness due to surface irregularities and fixed distance settings, leading to variations in cutting or grinding depths.
Innovation Solution
A processing method and machine that measure the wafer's thickness to determine the precise distance for coating, ensuring a uniform resin layer by adjusting the movement of the holder and table relative to each other based on the wafer's measured thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a fixed distance is used for coating the wafer with resin, then the coating process is simple and fast, but the resin thickness varies due to wafer thickness variations
Solution Approach 1:
The patent applies dynamics by making the distance between the holder and table adjustable rather than fixed. The system dynamically changes the relative position based on measured wafer thickness, allowing the coating process to adapt to each wafer's specific dimensions while maintaining consistent resin thickness.
Solution Approach 2:
The patent changes the parameter of holder-table distance based on wafer thickness measurements. By adjusting this critical parameter according to actual wafer dimensions, the system achieves uniform resin coating thickness despite variations in wafer thickness, resolving the contradiction between fixed-process simplicity and precision requirements.
2Ease of operation
If the holder and table are brought closely together with a predetermined fixed distance, then the operation is simple, but wafer thickness variations cause non-uniform resin coating
Solution Approach 1:
The patent applies preliminary action by measuring the wafer thickness before the coating process. This pre-measurement allows the system to determine the appropriate holder-table distance in advance, ensuring that the subsequent coating operation achieves uniform resin thickness without requiring complex real-time adjustments during the coating process itself.
Solution Approach 2:
The patent implements feedback by using the measured wafer thickness information to adjust the holder-table distance. The measurement result feeds back into the positioning system, creating a closed-loop control that automatically compensates for wafer thickness variations and ensures consistent resin coating quality.
3Device complexity
If resin coating is performed without measuring wafer thickness, then the process is faster and simpler, but cutting and grinding depths vary due to inconsistent resin layers
Solution Approach 1:
The patent applies preliminary action by performing wafer thickness measurement before resin coating. This pre-measurement step provides critical information that enables subsequent processing (cutting and grinding) to be performed at consistent depths, as the resin thickness is predetermined based on actual wafer dimensions rather than assumed fixed values.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces resin thickness variations, ensuring consistent coating and reducing errors in cutting or grinding processes.
Implementation Method 1
a first measuring section for contacting a portion of a face side of the wafer that protrudes from the temporary rest table and measuring a height of the face side of the wafer, a second measuring section for contacting a portion of a reverse side of the wafer that protrudes from the temporary rest table and measuring a height of the reverse side of the wafer
Implementation Method 2
hardening the liquid resin that has coated the wafer
Data Source
AI summary
There is provided a processing method including the steps of measuring a thickness of the wafer, holding the wafer on a holder, supplying a liquid resin to a table that faces the holder, relatively moving the holder and the table closely to each other to coat the wafer with the liquid resin, and hardening the liquid resin that has coated the wafer. In the resin applying step, a distance by which the holder and the table are to be relatively moved closely to each other to coat the wafer with the liquid resin is determined depending on the measured thickness of the wafer.