Resin Film Application on Semiconductor Wafer Frame Cleaning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing method for applying a resin film to a semiconductor wafer during laser dicing often results in solution scattering and adhering to the frame, causing issues with detachment from vacuum transport pads due to tackiness.
Innovation Solution
A method that includes supplying liquid droplets of resin solution to the semiconductor wafer, spreading them using a rotating chuck, and subsequently cleaning the frame surface with a cleaning fluid to prevent solution adherence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the chuck means is rotated at a high speed to spread liquid droplets, then the resin solution is effectively spread throughout the face of the semiconductor wafer, but the solution scatters and adheres to the surface of the frame
Solution Approach 1:
The patent extracts and removes the scattered solution from the frame surface using a cleaning fluid supply means. The cleaning fluid is supplied to the frame surface to dissolve and remove the adhered resin solution, preventing contamination and ensuring clean processing.
Solution Approach 2:
The patent introduces a cleaning fluid as an intermediary substance to mediate between the scattered solution and the frame surface. The cleaning fluid acts as a mediator that dissolves the adhered solution and facilitates its removal, preventing direct contamination of the frame.
2Reliability
If the solution adheres to the frame surface, then the assembly cannot be detached from the vacuum pad due to tackiness, but the vacuum pad is needed for transport
Solution Approach 1:
The patent performs preliminary cleaning action by supplying cleaning fluid to the frame surface before the detachment process. This preliminary cleaning removes the tacky solution from the frame surface, preventing it from interfering with the subsequent vacuum pad detachment operation.
Solution Approach 2:
The patent rushes through the potential problem by quickly removing the scattered solution through cleaning fluid supply. This prevents the solution from adhering and causing detachment issues, allowing the process to move quickly to the next step without interruption.
3Ease of manufacture
If liquid droplets are supplied to the central portion of the semiconductor wafer, then the resin coating can be applied, but the solution scatters over the frame surface during rotation
Solution Approach 1:
The patent converts the harmful scattered solution into a removable substance by introducing cleaning fluid. The cleaning fluid transforms the contamination problem into a solvable issue by dissolving and removing the scattered solution, turning a harmful effect into a manageable process step.
Solution Approach 2:
The patent changes the physical state and properties of the scattered solution by introducing cleaning fluid with different chemical properties. The cleaning fluid alters the parameters of the adhered solution, making it soluble and removable, thus converting a persistent contamination into a removable residue.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures effective detachment of the semiconductor wafer assembly from transport pads by removing adhered solution, preventing sticking and facilitating smooth transport.
Implementation Method 1
the chuck means is rotated at a high speed, whereby the liquid droplets are spread throughout the face of the semiconductor wafer
Implementation Method 2
The pad is pressed against the surface of the frame to attract the assembly under vacuum
Data Source
AI summary
A method for applying a resin film to the face of a semiconductor wafer, comprising: an assembly holding step of holding an assembly on the surface of chuck means, with the back of the assembly being opposed to the surface of the chuck means, the assembly including a frame having a mounting opening formed in a central portion of the frame, and a semiconductor wafer mounted in the mounting opening of the frame by sticking a mounting tape to the back of the frame and the back of the semiconductor wafer; a liquid droplet supply step of supplying liquid droplets of a solution having a resin dissolved therein onto the face of the semiconductor wafer in the assembly after the assembly holding step; and a spreading step of rotating the chuck means subsequently to the liquid droplet supply step, thereby spreading the liquid droplets throughout the face of the semiconductor wafer. The method further comprises a cleaning step of rotating the chuck means and also supplying a cleaning fluid to the surface of the frame after the spreading step, thereby cleaning the solution which has adhered to the surface of the frame.