Wafer Protective Member Forming With Thickness-Adaptive Resin Control
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Solution Overview
Problem
Existing methods for forming protective members on wafers fail to account for variations in wafer thickness, leading to inefficiencies such as air bubble formation or prolonged processing times due to inconsistent speed transitions during resin application.
Innovation Solution
A protective member forming device and method that adjusts the height and speed of resin application based on actual wafer thickness measurements, using a controller to set positions and speeds dynamically to prevent air bubbles and ensure uniform resin distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the wafer is lowered at a constant speed regardless of distance, then the process is simple, but it is inefficient and may cause air bubbles or prolonged processing time
Solution Approach 1:
The patent applies dynamics by transitioning from constant speed to variable speed control. The lowering speed is dynamically adjusted based on the distance between the wafer and liquid resin: a first (faster) speed is used when the distance is large, and a second (slower) speed is used when the distance is small. This dynamic speed adjustment improves processing efficiency while preventing air bubbles, resolving the contradiction between productivity and process quality.
2Adaptability or versatility
If the switching position between first speed and second speed is set based on predetermined thickness, then the process is straightforward, but it fails to account for variations in actual wafer thickness
Solution Approach 1:
The patent implements feedback control by measuring the actual thickness of the wafer and using this information to adjust the switching position between first and second speeds. The control unit receives thickness measurement data and dynamically determines the optimal switching point, ensuring that the wafer is pressed against the liquid resin at the appropriate moment regardless of thickness variations. This feedback mechanism enhances adaptability while maintaining precise control.
Solution Approach 2:
The patent applies preliminary action by measuring the wafer thickness before the resin application process and pre-calculating the optimal switching position. This advance preparation allows the system to adapt to each wafer's specific thickness without requiring complex real-time adjustments during the pressing operation, balancing adaptability with process simplicity.
3Reliability
If the wafer is pressed against the liquid resin without leaving a gap, then the process time is reduced, but air bubbles may form between the wafer and resin
Solution Approach 1:
The patent applies periodic action through two-stage speed control: first, the wafer is lowered at a faster speed to approach the liquid resin; then, the speed is reduced to a slower second speed for the final pressing phase. This periodic variation in speed ensures that the wafer is pressed against the resin gradually and uniformly, preventing air bubble formation while minimizing the overall processing time. The transition between speed phases is timed based on measured wafer thickness.
Data Source
AI summary
A protective member forming device includes: a first holding unit; a second holding unit; a resin supply unit; a moving unit; and a controller, as defined herein, the controller includes an acquisition unit, a first movement controller configured to control the moving unit as defined herein, and a second movement controller configured to control the moving unit as defined herein, and the first movement controller is configured to set the first position to a position obtained by correcting a temporary first position, which is set in advance based on the reference thickness, based on a difference between the reference thickness and the actual thickness.