Wafer Retainer Damping Structure for Seismic Force Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High temperature heat-treatment processes for semiconductor wafers face challenges in adequately supporting wafers to prevent slip or deformation due to gravitational and thermal stresses, which existing vertical wafer boats may not effectively address, particularly under abnormal external forces like seismic events.
Innovation Solution
A substrate processing apparatus incorporating a substrate retainer with elastic and damping members that absorb and dampen forces, ensuring stable support and minimizing movement during normal and abnormal conditions, such as seismic events, using a combination of elastic members and damping members strategically positioned between the substrate retainer support base and cap.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If vertical wafer boats are used to support substrates during high temperature heat-treatment, then substrate support stability is improved, but the system becomes vulnerable to seismic forces and abnormal external forces causing slip or deformation
Solution Approach 1:
The patent applies beforehand cushioning by incorporating damping members and elastic members into the substrate retainer support structure before seismic or abnormal forces occur. These members are pre-positioned to absorb and dampen forces, providing proactive protection rather than reactive response. The damping members are strategically placed between the substrate retainer support base and cap to cushion against anticipated seismic events.
Solution Approach 2:
The patent employs composite materials by combining damping members with elastic members in the substrate retainer support structure. This composite approach integrates materials with different mechanical properties - damping materials for energy dissipation and elastic materials for force absorption - creating a synergistic system that provides both stability and seismic resistance.
2Manufacturing precision
If rigid substrate support structures are used to prevent movement during high temperature processing, then manufacturing precision is improved, but the structure cannot absorb abnormal external forces
Solution Approach 1:
The patent applies parameter changes by modifying the mechanical properties of the substrate support system. Instead of using purely rigid structures, the system incorporates members with controlled elasticity and damping characteristics. This changes the support structure from rigid to semi-flexible, allowing it to maintain positioning accuracy while absorbing abnormal forces through elastic deformation and energy dissipation.
Solution Approach 2:
The patent uses intermediary elements - specifically damping members and elastic members - that act as mediators between the substrate retainer and the external environment. These intermediaries absorb and dampen seismic forces before they can directly affect the substrate, protecting the substrate from damage while maintaining manufacturing precision through controlled force transmission.
3Reliability
If damping members and elastic members are added to the substrate retainer support, then resistance to seismic forces is improved, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the substrate retainer support structure into distinct functional components: damping members, elastic members, support base, and support cap. This segmentation allows each component to be optimized for its specific function while maintaining overall system simplicity. The modular approach makes the complex system manageable and easier to manufacture.
Solution Approach 2:
The patent employs universality by designing the substrate retainer support structure to serve multiple functions simultaneously. The damping members and elastic members not only provide seismic resistance but also contribute to normal operational stability, thermal stress management, and substrate positioning. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively stabilizes the substrate retainer during normal operation and absorbs abnormal external forces, preventing damage to the wafers by minimizing movement and oscillations, thus ensuring the integrity of the wafers throughout the high-temperature processing.
Implementation Method 1
The substrate retainer transport mechanism includes a plurality of elastic members between the substrate retainer support base and the substrate retainer support cap and a plurality of damping members between the substrate retainer support base and the substrate retainer support cap
Implementation Method 2
The substrate retainer transport mechanism includes a plurality of elastic members between the substrate retainer support base and the substrate retainer support cap and a plurality of damping members between the substrate retainer support base and the substrate retainer support cap
Data Source
AI summary
Base plates of a substrate retainer transportation mechanism are provided with damping members to assist elastic members in damping and limiting movement of the substrate retainer transportation mechanism when the substrate transportation mechanism is subjected to unwanted external forces, e.g., seismic forces. By damping and limiting movement of the substrate retainer transportation mechanism, undesirable damage to substrates contained in a substrate retainer being carried by the substrate retainer transport mechanism can be minimized.