Wafer Transfer Chamber Return Duct for Lower Gas Flow Resistance
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Solution Overview
Problem
Existing wafer transfer devices face challenges in suppressing temperature rise within the transfer chamber due to heat generation from FFU motors and electric parts, which necessitate reducing fan rotational speed and enlarging column return ducts to decrease system resistance, leading to increased inert gas consumption and chamber size.
Innovation Solution
A wafer transfer device with a door return duct that allows inert gas to flow back to the FFU chamber when the door is closed, reducing system resistance without enlarging the chamber, using a rotary type door with a duct and adjustable inlet height to manage gas flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If the flow passage cross-sectional area of the column return ducts is increased to reduce system resistance, then the fan power consumption is reduced, but the wafer transfer chamber is enlarged and the injected amount of inert gas increases
Solution Approach 1:
The invention introduces a new spatial dimension for gas circulation by installing an FFU chamber above the wafer transfer chamber and creating vertical return flow passages through hollowed columns. This three-dimensional circulation path reduces system resistance without requiring enlargement of the horizontal chamber volume, thereby reducing fan power consumption while maintaining compact chamber size.
Solution Approach 2:
The return flow passages are formed by hollowing the columns that constitute the wafer transfer chamber, effectively nesting the gas circulation function within the structural elements of the chamber itself. This eliminates the need for separate external return ducts that would increase chamber volume, allowing reduced system resistance without chamber enlargement.
2Temperature
If the fan rotational speed is reduced to suppress temperature rise, then the power consumption is reduced, but the system resistance increases
Solution Approach 1:
By establishing vertical return flow passages through the hollowed columns and positioning the FFU chamber above the wafer transfer chamber, the invention creates a three-dimensional gas circulation pattern. This reduces system resistance through optimized flow paths, allowing the fan to operate at lower rotational speeds while maintaining adequate gas circulation, thus suppressing temperature rise without excessively increasing system resistance.
3Use of energy by moving object
If the column return ducts are enlarged to decrease system resistance, then the fan power consumption is reduced, but the inert gas injection amount increases
Solution Approach 1:
The return flow passages are integrated within the hollowed columns that form the structural framework of the wafer transfer chamber. This nesting approach allows the gas circulation system to utilize existing structural volume, enabling reduced system resistance and lower fan power consumption without requiring additional chamber volume or increased inert gas injection.
Solution Approach 2:
The invention creates vertical circulation paths through the hollowed columns, establishing a three-dimensional gas flow pattern. This efficient use of vertical space optimizes gas circulation and reduces system resistance without requiring horizontal expansion of the chamber, thereby reducing both fan power consumption and inert gas injection amount.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces system resistance and power consumption while maintaining chamber size, preventing temperature rise and minimizing inert gas usage.
Implementation Method 1
the inside of a sealed and closed wafer transfer chamber is filled with inert gas by the inert gas being supplied from a fan and filter unit (which will hereinafter be referred to as an FFU) chamber in order to decrease oxygen concentration in the wafer transfer chamber
Implementation Method 2
a circulating flow system in which inert gas is injected into an FFU chamber that is installed above the wafer transfer chamber and that includes an FFU, the inert gas is blown into the wafer transfer chamber by the FFU
Implementation Method 3
flow passages for the inert gas to return to the FFU chamber are formed by hollowing columns constituting the wafer transfer chamber, and the inert gas blown into the wafer transfer chamber by the FFU is returned to the FFU chamber
Data Source
AI summary
To obtain a wafer transfer device that can suppress a rise in the temperature of the inside of a wafer transfer chamber by reducing a system resistance without changing the size of the wafer transfer chamber, the present invention provides a wafer transfer device including a wafer transfer chamber including a robot configured to transfer a wafer between a FOUP configured to house the wafer and a processing chamber configured to process the wafer, a door installed for a human to enter and exit from an inside of the wafer transfer chamber, and a fan and filter unit (FFU) chamber installed above the wafer transfer chamber and configured to feed inert gas into the wafer transfer chamber, a return flow passage for the inert gas being formed in a column constituting the wafer transfer chamber and being formed by hollowing the column, to make the FFU chamber and the wafer transfer chamber communicate with each other, and a duct being provided on the wafer transfer chamber side of the door and configured such that the inert gas in the wafer transfer chamber passes through the duct and flows into the FFU chamber when the door is in a closed state.