Wafer Chuck Ring Cover Sealing for Faster Die Gap Cleaning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wafer processing apparatuses face challenges in efficiently removing foreign materials from gaps between dies during cleaning, leading to increased cleaning time and potential damage from misaligned sealing rings, which complicates the apparatus structure and increases manufacturing costs.
Innovation Solution
A wafer processing apparatus with a vacuum chuck, ring cover, and sealing ring that allows deformation and fluid supply, along with suction pads and a moving module to increase gaps between dies for effective cleaning, and a simplified structure for improved sealing and reduced misalignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing ring is coupled to the rotating table to seal the circumferential portion, then sealing performance is improved, but coupling errors (misalignment) may occur and structure becomes more complex
Solution Approach 1:
The patent extracts the sealing function from a separate sealing ring component and integrates it into the ring cover itself. The ring cover is designed with a sealing surface that directly contacts the wafer or substrate, eliminating the need for a separate sealing ring and its associated coupling mechanisms. This reduces structural complexity while maintaining sealing performance.
Solution Approach 2:
The patent merges the sealing function with the ring cover structure. The ring cover serves dual purposes: it provides the necessary mechanical support and positioning while simultaneously providing the sealing surface. This consolidation eliminates the separate sealing ring component and reduces the number of coupling operations required.
2Reliability
If a sealing ring is coupled to the rotating table, then sealing is achieved, but coupling process is cumbersome and time-consuming
Solution Approach 1:
The patent removes the separate sealing ring component and its associated coupling process. The sealing function is extracted and integrated into the ring cover design, which can be installed as a single piece without the cumbersome multi-step coupling process previously required for separate sealing rings.
Solution Approach 2:
The sealing surface is pre-integrated into the ring cover structure during manufacturing. This preliminary integration of the sealing function eliminates the need for separate coupling operations during assembly, making the manufacturing process simpler and faster.
3Manufacturing precision
If wafer fixing module and sealing ring fixing module are installed to prevent position variation, then positioning accuracy is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the wafer fixing function and sealing function into a single integrated structure. The ring cover simultaneously provides wafer positioning and sealing, eliminating the need for separate fixing modules and reducing overall device complexity while maintaining positioning accuracy.
Solution Approach 2:
The ring cover is designed as a multi-functional component that performs both wafer positioning and sealing operations. This universal component replaces what would traditionally require separate dedicated modules, reducing device complexity and manufacturing cost while maintaining the required positioning precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves cleaning performance, reduces processing time, and decreases the defective rate by efficiently removing foreign materials and minimizing structural complexity and manufacturing costs.
Implementation Method 1
a vacuum chuck on which a wafer is seated
Implementation Method 2
a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck
Implementation Method 3
A deformation space may be formed inside the sealing ring to allow the sealing ring to be deformed when the ring cover presses
Implementation Method 4
a plurality of suction pads installed on a vacuum port of the vacuum chuck to suction a retainer ring on the wafer
Data Source
AI summary
A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.