Wafer Ring Support Layout for Same-Height Wafer Transfer
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Solution Overview
Problem
Existing wafer delivery devices face complexity in delivering wafers from/to vertically stacked rings due to misalignment of supported elements, requiring intricate mechanisms for vertical and circumferential movement, which complicates the structure and limits the ability to deliver wafers at the same height from multiple rings.
Innovation Solution
A wafer delivery device with alternately stacked rings and a support system featuring fixed support pieces and driving mechanisms that switch between positions to align with different ring positions, allowing for simultaneous support and delivery at the same height, eliminating the need for a link mechanism and simplifying the structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the support piece is moved up or down and the rings are moved in a circumferential direction to deliver wafers from/to vertically stacked rings, then wafer delivery is enabled across multiple rings, but the structure of the wafer delivery device becomes complicated
Solution Approach 1:
The device is divided into multiple independent ring support units, each capable of supporting one ring. Each support unit can be independently positioned and controlled, allowing simplified individual management rather than complex coordinated movement of all rings simultaneously.
Solution Approach 2:
The invention introduces a vertical stacking dimension for rings, where rings are arranged one above another. The support piece can selectively support rings at different vertical levels, enabling wafer delivery from multiple rings without requiring complex horizontal repositioning of all rings.
2Device complexity
If the vertical position of the support piece is fixed at a predetermined position to simplify the structure, then the structure is simplified, but the wafer delivery device may be unable to deliver the wafer from/to each of a plurality of rings at the same height
Solution Approach 1:
The support piece is designed with movable components that can dynamically adjust their positions. The support piece can move in the vertical direction to align with different ring levels, and can also rotate to position support surfaces at appropriate angular locations, enabling flexible adaptation while maintaining structural simplicity.
Solution Approach 2:
The support piece is designed as a multi-functional component that can support multiple rings at different positions and orientations. By incorporating rotational and vertical movement capabilities, a single support piece design can serve multiple rings throughout the stack, eliminating the need for multiple specialized support mechanisms.
Data Source
AI summary
In a wafer storage container, a first ring and a second ring are stacked alternatively in a vertical direction. A wafer delivery device is provided with a first ring support and a second ring support. The first ring support includes a first support piece fixed at the vertical position and a first driving mechanism to drive the first support piece. The first driving mechanism is selectively switchable among a first state, a second state, and a third state. In the first state, the first support piece overlaps with the first position in a plan view. In the second state, the first support piece overlaps with the second position in a plan view. In the third state, the first support piece does not overlap with the first and the second positions in a plan view.