Wafer Rinsing Nozzle Layout for Complete Residue Removal
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Solution Overview
Problem
Existing rinsing stations for producing contact metallizations on wafer terminal faces do not allow optimal rinsing and cleaning, leading to reduced quality of the metallizations due to incomplete residue removal.
Innovation Solution
A rinsing station with a basin designed to receive a rinsing liquid, featuring a nozzle arrangement with fan, full-cone, or hollow-cone nozzles that direct the liquid onto the wafer, combined with a free drain outlet and a sample-analysis device to ensure thorough cleaning and continuous rinsing cycles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a simple inlet opening is used to feed rinsing liquid into the basin, then the device complexity is reduced, but the rinsing quality and residue removal effectiveness deteriorate
Solution Approach 1:
The inlet is segmented into multiple nozzles arranged in a specific pattern, where each nozzle delivers rinsing liquid to a different region of the wafer. This segmentation allows targeted rinsing of various areas, improving overall rinsing quality while maintaining a relatively simple overall structure
Solution Approach 2:
Different nozzles are positioned to provide localized rinsing coverage across the wafer surface. The nozzle arrangement ensures that rinsing liquid is delivered with appropriate local intensity and direction to each region, optimizing residue removal effectiveness
2Ease of manufacture
If rinsing liquid is fed through a simple inlet opening, then the ease of manufacture is improved, but the completeness of residue removal deteriorates
Solution Approach 1:
The inlet structure is divided into multiple nozzles that can be manufactured using standard nozzle components. While more complex than a single opening, the modular nozzle design allows for relatively straightforward manufacturing and assembly, achieving a balance between ease of manufacture and effective residue removal
Solution Approach 2:
The nozzle arrangement utilizes hydraulic principles to deliver rinsing liquid with optimized flow patterns, pressure distribution, and coverage area. This hydraulic design ensures complete residue removal while maintaining a manufacturable structure using conventional fluid delivery components
3Manufacturing precision
If a nozzle arrangement with fan, full-cone, or hollow-cone nozzles is used, then the rinsing effectiveness and residue removal are improved, but the device complexity increases
Solution Approach 1:
The nozzle arrangement is segmented into specific types (fan, full-cone, hollow-cone nozzles) positioned at different locations to address specific rinsing requirements. This segmentation allows optimization of rinsing effectiveness for different wafer regions while keeping each individual nozzle component relatively simple and standardized
Solution Approach 2:
The nozzle arrangement uses standard nozzle types that can serve multiple functions - fan nozzles for broad coverage, full-cone nozzles for intense localized rinsing, and hollow-cone nozzles for edge-area coverage. This multi-functionality approach achieves comprehensive rinsing effectiveness while using relatively simple, standardized components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables complete residue removal, resulting in higher-quality contact metallizations by optimizing the rinsing process through directed liquid application and continuous liquid exchange, ensuring efficient cleaning and quality control.
Implementation Method 1
the nozzle arrangement having at least one nozzle by means of which the rinsing liquid can be applied being directed onto the wafer
Data Source
AI summary
A rinsing station (10) includes a basin (12) forming a processing chamber (11) and serving to receive a rinsing liquid, in particular containing deionized water, for rinsing a wafer (14) receivable in the processing chamber, the basin having at least one inlet (15) for feeding the rinsing liquid into the basin. The inlet is designed as a nozzle arrangement (16), the nozzle arrangement having at least one nozzle (17) by means of which the rinsing liquid can be applied being directed onto the wafer, the nozzle being designed as a fan nozzle or a full-cone nozzle or a hollow-cone nozzle.