Adaptive Wafer Robot Calibration Using Sensorized APS Wafers
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Solution Overview
Problem
Semiconductor processing tools face challenges in accurately positioning wafers due to variance in relative positioning between the wafer-handling robot's end effector and the semiconductor wafers, which can lead to non-uniform processing results.
Innovation Solution
An autocalibration system using an adaptive positioning system (APS) wafer with integrated sensors, which allows for automated teaching and calibration of the wafer-handling robot, ensuring precise placement of wafers and edge rings on wafer supports.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If automated calibration is implemented, then productivity is improved, but device complexity increases
Solution Approach 1:
The calibration wafer is equipped with onboard imaging sensors and a controller that enable it to autonomously detect its position and provide feedback signals to the wafer-handling robot controller, eliminating the need for external measurement equipment and manual calibration operations
Solution Approach 2:
The calibration wafer serves multiple functions: it acts as a test object for the robot, a reference standard for position measurement, and an active sensor platform that autonomously detects positioning accuracy and communicates results back to the control system
2Loss of time
If manual teaching is used, then device complexity is reduced, but loss of time increases
Solution Approach 1:
The system replaces manual mechanical teaching operations with an automated optical measurement system where imaging sensors on the calibration wafer capture position data and the controller automatically processes this information to update robot positioning parameters
Solution Approach 2:
The imaging sensors on the calibration wafer detect the actual position of the wafer relative to the robot end effector, and the controller uses this feedback information to automatically adjust and optimize the robot's positioning accuracy
Data Source
AI summary
Systems and techniques for determining and using multiple types of offsets for providing wafers to a wafer support of a wafer station of a semiconductor processing tool are disclosed; such techniques and systems may use an autocalibration wafer that may include a plurality of sensors, including a plurality of edge-located imaging sensors that may be used to image fiducials associated with two different structures located in a selected wafer station.