Wafer Transfer Robot Gear Temperature Monitoring Without Contact
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Solution Overview
Problem
In multi-joint robots used for transferring semiconductor wafers, directly measuring the temperature of gears at joints is challenging due to heat generation and the difficulty in maintaining airtightness at high temperatures, leading to potential abnormality and leakage issues.
Innovation Solution
A transfer apparatus with detectors that face the gears without contacting them, using radiation thermometers to measure the temperature of gear end surfaces, allowing for direct temperature detection and monitoring, and a controller to manage operations based on temperature thresholds to prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If temperature sensors such as thermocouples are disposed on the housing to indirectly measure temperature, then the device complexity is reduced, but the measurement precision deteriorates because the housing has a large area resulting in low temperature responsiveness
Solution Approach 1:
The patent replaces contact-based mechanical temperature sensors (thermocouples) with a non-contact optical detection system. The detector uses optical radiation (infrared) to measure temperature, substituting the mechanical contact method with an optical field-based measurement, thereby achieving both direct gear temperature measurement and maintaining device simplicity
Solution Approach 2:
The patent creates an optical copy (infrared radiation image) of the gear's thermal state without physically contacting the gear. The detector captures the thermal radiation emitted by the gear, creating an informational copy of the temperature distribution that can be measured remotely with high precision
2Measurement precision
If detectors are disposed to face the gear to directly measure temperature, then the measurement precision is improved, but the device complexity increases due to additional components and installation requirements
Solution Approach 1:
The detector is designed with multi-functionality, serving both as a temperature measurement device and potentially as part of the control system. By integrating temperature detection capabilities into a universal sensing platform, the patent reduces the need for separate dedicated temperature measurement components, thereby managing device complexity while maintaining high measurement precision
Solution Approach 2:
The patent introduces optical radiation (infrared) as an intermediary medium between the gear and the detector. This intermediary allows temperature information to be transmitted without direct physical contact, enabling precise measurement while avoiding the complexity of installing sensors in difficult-to-reach locations within the gear mechanism
3Productivity
If the gear operates at high temperature, then the productivity is improved through faster operation, but the reliability deteriorates due to potential leakage and abnormality from heat generation
Solution Approach 1:
The patent implements a feedback mechanism where the detector continuously monitors gear temperature and provides real-time temperature data to the control system. This feedback loop enables the system to adjust operations based on actual thermal conditions, allowing high-speed operation when temperatures are acceptable while preventing overheating that would compromise reliability
Solution Approach 2:
The patent performs preliminary temperature monitoring and assessment before critical overheating occurs. By detecting temperature trends early through continuous non-contact measurement, the system can take preventive actions (such as reducing speed or activating cooling) before reliability is compromised, enabling sustained high-productivity operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise temperature monitoring of gears, preventing overheating and potential leakage, ensuring continuous operation and reducing the risk of semiconductor manufacturing process interruptions.
Implementation Method 1
a detector disposed to face the at least one gear and configured to detect a temperature of the at least one gear without contacting the at least one gear
Data Source
AI summary
According to one embodiment of the present disclosure, there is provided a transfer apparatus comprising at least one arm configured to support a substrate; at least one gear disposed at a joint that rotatably supports the at least one arm, the at least one gear rotating the at least one arm; and a detector disposed to face the at least one gear and configured to detect a temperature of the at least one gear without contacting the at least one gear.