Wafer Transfer Robot Link Layout for Clean, Interference-Free Handling

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Solution Overview

Problem

Existing wafer transfer apparatuses face challenges in preventing dust scattering and interference within the apparatus, with complex structures and the need for direct acting mechanisms that degrade cleanliness and increase production costs.

Innovation Solution

A wafer transfer apparatus with a wafer carrying robot that includes a robot arm with a base, link members, and a drive unit, where the minimum rotation radius is set to exceed half of the interface space length, allowing for a simplified structure and reduced interference, eliminating the need for a direct acting mechanism and enhancing control and reach.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a direct acting mechanism is used to drive the robot arm, then the structure is simpler, but dust scattering increases and cleanliness deteriorates

Engineering Contradiction:
Improvestructure complexityVSAvoiddust scattering
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

A belt mechanism is introduced as an intermediary between the drive unit and the robot arm. The drive unit rotates the belt, which then transmits motion to the robot arm through the link members. This intermediary mechanism allows the drive unit to be positioned away from the interface space, preventing direct acting mechanisms from scattering dust while still achieving simple structural drive.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If the robot arm structure is made more complex to improve control, then control precision improves, but device complexity increases and production cost increases

Engineering Contradiction:
Improvecontrol precisionVSAvoidapparatus structure complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The robot arm employs a dynamic link mechanism where link members can angularly displace relative to each other about joint axes. This dynamic structure allows the arm to achieve complex motion paths and precise positioning through coordinated angular displacement of multiple links, rather than requiring a statically complex mechanism with more components.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The robot arm operates in three-dimensional space with angular displacement about multiple joint axes (first joint axis, second joint axis). By utilizing rotational degrees of freedom in different dimensions, the system achieves precise control capability without increasing the number of linear components or structural complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Length of moving object

If the minimum rotation radius is increased to improve reach, then the robot arm can reach farther positions, but the apparatus size increases and may cause interference

Engineering Contradiction:
Improverobot arm reachVSAvoidapparatus footprint
Core Design Contradiction:
Length of moving objectVSArea of stationary object

Solution Approach 1:

The robot arm uses angular displacement of link members about joint axes to extend reach dynamically. The minimum rotation radius is optimized to exceed half the interface space length, allowing the arm to reach positions near the front wall when links are extended, while retraction is achieved by angular displacement that brings links closer to the pivot axis, maintaining a compact footprint.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The link members are arranged so that they can overlap or nest during retraction. The second link member can be positioned within the sweep of the first link member, and the third link member within the second, allowing the robot arm to minimize its rotation radius when not in use, reducing interference while maintaining full reach capability.

Inventive Principle:
Principle #7Nested doll (Nesting)

Data Source

PatentUSRE49671E1Wafer transfer apparatus and substrate transfer apparatus
Publication Date: 2023.09.26 KAWASAKI JUKOGYO KK
  • USRE49671E1 patent drawing
  • USRE49671E1 patent drawing
  • USRE49671E1 patent drawing

AI summary

A wafer transfer apparatus is provided. In a minimum transformed state where a robot arm is transformed such that a distance defined from a pivot axis to an arm portion, which is farthest in a radial direction relative to the pivot axis, is minimum, a minimum rotation radius R, is set to exceed ½ of a length B in the forward and backward directions of an interface space, the length B corresponding to a length between the front wall and the rear wall of the interface space forming portion, and is further set to be equal to or less than a subtracted value obtained by subtracting a distance L0 in the forward and backward directions from the rear wall of the interface space forming portion to the pivot axis, from the length B in the forward and backward directions of the interface space (i.e., B/2<R≤B−L0).