Wafer Transfer Robot Speed Control Using Static Charge Prediction
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Solution Overview
Problem
Existing methods fail to efficiently monitor and manage static electricity during semiconductor manufacturing processes, leading to potential damage to IC circuits due to electrostatic discharge, especially in highly susceptible miniaturized devices, and lack continuous electrostatic management capabilities.
Innovation Solution
A method and apparatus using temperature and humidity sensors to predict electrostatic voltage, calculate static elimination time, and adjust wafer transfer robot speed to efficiently eliminate static electricity, incorporating a non-contact static elimination system with a controller and management system for predictive maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If static eliminators are used to offset static electricity, then static electricity is reduced, but there is no way to monitor the amount of static electricity at all times
Solution Approach 1:
The patent implements a feedback mechanism by installing sensors that continuously monitor static electricity levels on wafers and feed this information back to the control system. This allows real-time monitoring of static electricity amounts, enabling dynamic adjustment of static elimination processes and providing continuous data for process optimization.
Solution Approach 2:
The patent introduces sensors as intermediary devices between the static elimination system and the control system. These sensors act as mediators that detect static electricity levels and transmit this information to the controller, enabling indirect monitoring and control of static electricity without direct contact with the wafer.
2Productivity
If manufacturing process is performed 24 hours per day without interruption, then productivity is improved, but it is difficult to monitor the amount of static electricity every time even when there is a problem
Solution Approach 1:
The patent implements continuous static electricity monitoring throughout the 24-hour manufacturing process. Sensors continuously measure static electricity levels on wafers as they move through the production line, ensuring uninterrupted monitoring that matches the continuous manufacturing operation without requiring manual intervention or process interruptions.
Solution Approach 2:
The system performs self-monitoring of static electricity conditions through automatically deployed sensors and control systems. The manufacturing process monitors its own static electricity levels without external intervention, enabling continuous quality assurance throughout uninterrupted production cycles.
3Productivity
If transfer speed of wafer transfer robot is increased, then productivity is improved, but static electricity cannot be eliminated efficiently
Solution Approach 1:
The patent implements dynamic speed control of the wafer transfer robot based on real-time static electricity measurements. The robot's transfer speed is continuously adjusted according to the measured static electricity levels and the time required for effective static elimination, optimizing both productivity and static electricity management throughout the manufacturing process.
Solution Approach 2:
The system dynamically changes the transfer speed parameter of the wafer transfer robot based on static electricity conditions. When static electricity levels are high or elimination time is required, the speed is reduced; when conditions permit, speed is increased, thereby optimizing both productivity and static electricity elimination efficiency through parameter adjustment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Accurately predicts and eliminates static electricity without surface damage, enhances product yield, and enables predictive maintenance by identifying environmental factors affecting static electricity, reducing resource consumption in problem analysis.
Implementation Method 1
a situation occurs in which static electricity remains on the product due to the influence of the process or environmental influences. When electricity of a high voltage flows temporarily in a semiconductor wafer due to an electrostatic discharge
Implementation Method 2
acquiring, when a wafer is transported by an end effector of the wafer transfer robot, temperature and humidity data around the wafer from a temperature sensor and a humidity sensor
Implementation Method 3
acquiring, when a wafer is transported by an end effector of the wafer transfer robot, temperature and humidity data around the wafer from a temperature sensor and a humidity sensor
Data Source
AI summary
The present invention relates to a method of controlling a wafer transfer robot using static electricity prediction, and the method includes acquiring, when a wafer is transported by an end effector of the wafer transfer robot, temperature and humidity data around the wafer from a temperature sensor and a humidity sensor of a static elimination system installed in a non-contact manner with the end effector of the transfer robot, predicting an electrostatic voltage by substituting the acquired data into a predetermined humidity-electrostatic voltage graph, calculating a static elimination time of the predicted electrostatic voltage, performing static elimination on the wafer during the calculated static elimination time, and adjusting a transfer speed of the transfer robot based on the calculated static elimination time.