Wafer Transfer Robot Vacuum Feedback for Secure High-Speed Handling

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Wafer transfer robots in semiconductor fabrication facilities face challenges in achieving fast and secure transfer of wafers without risking damage, as existing technologies struggle to accurately monitor and adjust vacuum levels for secure wafer handling.

Innovation Solution

The implementation of a vacuum level monitoring system that uses sensors to detect specific vacuum zones and transitions, allowing the robot to alter its operating state based on detected vacuum levels, ensuring secure wafer handling and preventing damage by adjusting acceleration and velocity accordingly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If vacuum level is increased to securely hold wafer, then wafer holding reliability is improved, but wafer breakage risk increases due to excessive force

Engineering Contradiction:
Improvewafer holding reliabilityVSAvoidwafer breakage risk
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent employs vacuum sensors to continuously monitor vacuum levels and provides feedback to the control system. This feedback mechanism enables real-time detection of vacuum zone transitions, allowing the robot to dynamically adjust its operating state and acceleration profiles to maintain secure wafer holding without exceeding safe force thresholds that could cause breakage.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent implements dynamic adjustment of robot acceleration and velocity based on detected vacuum zones. The operating state of the robot is altered according to vacuum level conditions, enabling the system to optimize holding force in real-time rather than using fixed parameters, thus preventing both drop-off and breakage.

Inventive Principle:
Principle #15Dynamics

2Productivity

If robot acceleration is increased to improve throughput, then productivity is improved, but wafer breakage risk increases

Engineering Contradiction:
ImprovethroughputVSAvoidwafer breakage risk
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent dynamically adjusts robot acceleration and velocity based on vacuum zone detection. By monitoring vacuum levels and identifying transitions between zones, the system optimizes acceleration profiles in real-time, enabling high-speed operation when vacuum is secure while reducing acceleration when vacuum conditions indicate potential instability, thus maintaining high throughput without increasing breakage risk.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

Vacuum sensor feedback enables the control system to continuously monitor holding conditions and adjust acceleration accordingly. This closed-loop control allows the robot to operate at maximum safe acceleration by detecting vacuum stability, thereby maximizing throughput while preventing wafer breakage through real-time parameter adjustment.

Inventive Principle:
Principle #23Feedback

3Reliability

If vacuum monitoring precision is improved to accurately detect wafer holding state, then wafer handling security is improved, but system complexity increases

Engineering Contradiction:
Improvewafer handling securityVSAvoidsystem complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces complex mechanical monitoring systems with vacuum sensors that leverage the existing vacuum infrastructure. By using pressure sensors to detect vacuum zone transitions, the system achieves precise wafer holding state detection without adding substantial mechanical complexity, as the sensors integrate with the existing vacuum ports and lines already present in the robot system.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient and secure wafer transfer by accurately determining when a wafer is securely held, allowing for maximum speed and acceleration, while preventing damage by reducing speed when necessary, thus enhancing productivity and reducing wafer breakage risks.

Implementation Method 1

a vacuum sensor coupled to the vacuum line

Methodology Applied
Scientific EffectVacuum: Vacuum

Data Source

PatentUS11850756B2Robot monitoring and error detection system
Publication Date: 2023.12.26 WAFERPATH INC
  • US11850756B2 patent drawing
  • US11850756B2 patent drawing
  • US11850756B2 patent drawing

AI summary

A method of operating a robot includes detecting the occurrence of an abnormal operating condition of the robot during operation from hardware state data relating to the operation of the robot system. In response, current hardware state data of the robot at the time of the detection is captured, including robot positional information. A counter corresponding to the abnormal operating condition may then be incremented and, if the counter exceeds a threshold value or exceeds a threshold value in a certain time, a report may be generated including the captured hardware state data. The abnormal condition may for example be a fluctuation in vacuum level or a data transmission error.