Wafer Handling Robot Arm With Vibration and Image Inspection
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Solution Overview
Problem
Existing robotic arms used in wafer transportation lack integrated mechanisms for inspecting wafer storage status and detecting operation abnormalities, leading to mutual influences between mechanical instability and inspection errors, which can result in wafer damage and reduced efficiency.
Innovation Solution
The integration of an image acquiring device, first and second vibration detectors, and a monitoring device into a robotic arm, allowing for simultaneous inspection of wafer storage status, impact sensing, and lifespan prediction, thereby preventing mutual influences between mechanical instability and inspection errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a robotic arm is used for wafer transportation without integrated vibration detection and image recognition, then the device complexity is reduced, but the measurement precision of wafer storage status and operation stability deteriorates
Solution Approach 1:
The patent combines the image acquiring device and vibration detectors with the robotic arm into an integrated monitoring system. The image acquiring device is mounted on the robotic arm to capture wafer storage status, while vibration detectors are integrated to monitor robotic arm operations, merging inspection functions with the transportation device itself.
Solution Approach 2:
The robotic arm is designed to perform multiple functions: wafer transportation, wafer storage status inspection through the image acquiring device, and operation stability monitoring through vibration detectors. This multi-functional design allows the same device to both transport wafers and monitor its own operational status simultaneously.
2Reliability
If vibration detection and image recognition are integrated into the robotic arm, then the reliability of wafer transportation is improved, but the device complexity increases
Solution Approach 1:
The system performs preliminary inspection of wafer storage status using the image acquiring device before transportation operations begin. Vibration detectors continuously monitor the robotic arm during operation to detect potential issues before they lead to wafer damage, enabling preventive rather than reactive measures.
Solution Approach 2:
The vibration detectors provide real-time feedback on robotic arm operation stability, and the image acquiring device provides feedback on wafer storage status. This feedback loop allows the system to adjust operations to maintain reliability, with the monitoring device analyzing data from both sensors to detect abnormalities.
3Loss of information
If the robotic arm operates without vibration monitoring, then the productivity is maintained, but the loss of information regarding operation abnormality increases
Solution Approach 1:
The robotic arm system performs self-diagnosis through integrated vibration detectors and image acquiring devices. The monitoring device analyzes data from these sensors to automatically detect operation abnormalities and wafer storage issues without requiring external inspection, allowing the system to monitor itself during normal production operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the accuracy of wafer movement and identification by preventing inspection errors caused by mechanical instability, reducing the risk of wafer damage, and improving the efficiency of wafer transportation processes.
Implementation Method 1
an image acquiring device...to acquire a wafer image
Implementation Method 2
the first vibration detector...the second vibration detector...provide functions in respect of inspection of an impact situation of the robotic arm, prediction of vibration of the wafer on the robotic arm
Data Source
AI summary
Disclosed in a robotic arm with vibration detection and image recognition, of which a main structure includes a wafer transportation device, a robotic arm rotatably mounted on the wafer transportation device, an image acquiring device arranged on the robotic arm, at least one first vibration detector arranged on the robotic arm, a second vibration detector arranged in an interior of the wafer transportation device, and a monitoring device arranged at one side of the wafer transportation device. The monitoring device includes a status inspecting part in information connection with the image acquiring device and a vibration inspecting part in information connection with the first vibration detector and the second vibration detector. By means of the above structure, the robotic arm is additionally provided with functions of wafer storage status inspecting, impact sensing, and lifespan predicting, so as to prevent mutual influence between machine structure operation instability and inspection error.