Wet Bench Roller Agitation for Wafer Residue Deposition
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Solution Overview
Problem
Wet benches in semiconductor manufacturing face issues with processing residue deposition on wafers due to unchanged flow fields, leading to damage and contamination, which reduces product yield.
Innovation Solution
The introduction of a mechanism, such as rollers, to disturb the flow field of processing agents in the wet bench tank, dispersing residue and minimizing its deposition on wafers and lifting devices, thereby reducing damage and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a wet bench tank uses a static flow field for processing agents, then the processing agent can circulate and process multiple batches of wafers, but processing residue deposits on wafers and lifting devices causing damage and contamination
Solution Approach 1:
The patent applies the dynamics principle by making the lifting devices movable rather than static. The lifting devices are configured to move between a first position (for wafer loading/unloading) and a second position (for processing). This dynamic positioning changes the flow field characteristics during processing, preventing residue from depositing on the lifting devices and wafers while maintaining the ability to process multiple batches.
2Productivity
If the processing agent circulates in a unchanged flow field, then processing is efficient and consistent, but residue accumulates and deposits on wafers reducing product yield
Solution Approach 1:
The lifting devices dynamically change position during the processing cycle, which dynamically alters the flow field. This prevents residue accumulation while maintaining processing efficiency, as the moving lifting devices disrupt the stagnant flow patterns that would otherwise cause deposition.
3Device complexity
If lifting devices remain stationary during processing, then the structure is simple and stable, but residue deposits on them and transfers to wafers causing contamination
Solution Approach 1:
The lifting devices are designed to move to a second position during processing, which prevents residue deposition. This dynamic movement adds some complexity but eliminates contamination issues. The movement is achieved through drive mechanisms that relocate the lifting devices away from the processing zone where residue would accumulate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces damage and contamination on wafers by dispersing processing residue, improving processing efficiency and product yield without requiring additional space in the tank.
Implementation Method 1
spin the one or more wafers to disturb a flow field of the processing agent
Data Source
AI summary
The present disclosure describes an apparatus for processing one or more objects. The apparatus includes a carrier configured to hold the one or more objects, a tank filled with a processing agent and configured to receive the carrier, and a spinning portion configured to contact the one or more objects and to spin the one or more objects to disturb a flow field of the processing agent.