Wafer Rotation and Support in Thermal Processing
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Solution Overview
Problem
Traditional rapid thermal processing (RTP) chambers have a large footprint due to the need for large substrate support actuators and heating sources, which limits their compactness and efficiency in semiconductor substrate processing.
Innovation Solution
The RTP chamber design features a heating assembly positioned below the substrate support assembly and a drive mechanism located above, allowing for a more compact configuration with a central drive mechanism and radiant heating sources, reducing the overall chamber size and footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the heating assembly and drive mechanism are positioned on the same side of the substrate support, then the chamber configuration is simplified, but the chamber footprint becomes large
Solution Approach 1:
The patent positions the heating assembly below the substrate support and the drive mechanism above the substrate support, utilizing vertical spatial separation (z-dimension) rather than horizontal arrangement. This dimensional reorganization allows both components to coexist without increasing the chamber's horizontal footprint, effectively resolving the contradiction between compact footprint and functional complexity.
2Temperature
If large substrate support actuators and heating sources are used, then uniform heating coverage is achieved, but the chamber size increases
Solution Approach 1:
The heating assembly is configured with multiple radiant heating sources arranged in an array that corresponds to the substrate surface area. This localized distribution of heating elements ensures uniform thermal coverage across the substrate without requiring an oversized single heating source, thereby maintaining heating uniformity while minimizing chamber dimensions.
3Adaptability or versatility
If the substrate is positioned device side facing up for shared transfer devices, then compatibility with other processing chambers is improved, but the heating source must be positioned below increasing chamber height
Solution Approach 1:
Instead of positioning the heating source below the substrate when the device side faces up (which would increase chamber height), the patent inverts the conventional arrangement by placing the drive mechanism above the substrate and the heating assembly below, utilizing the vertical space efficiently. This inverted configuration maintains substrate compatibility while optimizing chamber compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables more efficient and uniform thermal processing with reduced chamber size, improving processing efficiency and flexibility in semiconductor fabrication by minimizing the footprint of the processing chamber.
Implementation Method 1
Thermal radiation is generally used to rapidly heat a substrate in a controlled environment to a maximum temperature of up to about 1350° C.
Implementation Method 2
The heating assembly comprises a plurality of radiant heating sources directing radiant energy toward the processing volume
Data Source
AI summary
Embodiments of the present invention provide thermal processing chambers including a drive mechanism and a heating assembly disposed on opposite sides of a substrate support assembly. Particularly, the heating assembly is disposed below the substrate support assembly to process a substrate with a device side facing up and the drive mechanism is disposed above the substrate assembly.