Wafer-Scale Chip Package With Cavity And Through-Hole
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Solution Overview
Problem
Current chip packaging processes face challenges in reducing package size, increasing production efficiency, and lowering costs and time required for processing.
Innovation Solution
A chip package design featuring a substrate with a sensing layer, conducting pad structure, and spacer layer, where a semiconductor substrate is placed to surround a cavity with a through-hole connecting to the sensing region, allowing for reduced size and efficient fabrication of multiple packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional chip packaging processes are used, then electrical connections and protection are provided, but package size is large and processing time and cost are high
Solution Approach 1:
The patent combines multiple packaging operations into a single wafer-scale packaging process. Multiple chips are packaged simultaneously on a wafer substrate, merging individual packaging steps into a collective process that reduces both package size and processing time while maintaining electrical connection integrity
Solution Approach 2:
The invention transitions from traditional individual chip packaging to wafer-scale packaging, adding the dimension of parallel processing. By packaging multiple chips simultaneously on a wafer, the process achieves size reduction and time efficiency through dimensional scaling from single-unit to multi-unit concurrent packaging
2Ease of manufacture
If conventional chip packaging processes are used, then electrical connections are provided, but processing cost is high
Solution Approach 1:
The patent merges multiple packaging operations into a single wafer-scale process, combining chip mounting, encapsulation, and electrical connection formation into one integrated workflow. This merging reduces per-unit processing cost while simultaneously increasing production efficiency through parallel processing of multiple chips
Solution Approach 2:
The invention performs preliminary wafer-scale preparation and packaging operations before final chip separation. By conducting packaging actions on the wafer level first, then separating individual packaged chips, the process achieves cost efficiency through bulk processing while maintaining high productivity through pre-organized packaging structures
Data Source
AI summary
A chip package for a sensing element. The chip package includes a substrate having a first surface and a second surface, and a sensing layer having a sensing region disposed on the first surface of the substrate. A conducting pad structure is disposed on the substrate and electrically connected to the sensing region, and a spacer layer is disposed on the first surface of the substrate. A semiconductor substrate is place on the spacer layer. The semiconductor substrate, the spacer layer, and the substrate together surround a cavity on the sensing region. A through-hole extends from a surface of the semiconductor substrate toward the substrate, and connects to the cavity.