Wafer Scale Optics Alignment for MEMS Integration
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Solution Overview
Problem
The integration of optical components with micro-electromechanical systems (MEMS) devices poses challenges due to increased manufacturing costs and component reliability issues, particularly in reducing device size while addressing factors like cost, size, and power consumption in personal electronic devices.
Innovation Solution
The integration of optical components with MEMS devices is facilitated through the use of alignment/attachment features that mate between optical components and MEMS structures, allowing for the alignment and attachment of lenses and other optical components to MEMS structures, enabling a compact and efficient assembly process, including the use of wafer-level manufacturing and actuator integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If optical components and MEMS devices are integrated, then device functionality is improved, but manufacturing cost and reliability issues arise
Solution Approach 1:
The patent merges optical components and MEMS devices into a single integrated assembly where the optical component is directly attached to the MEMS structure. This combining approach improves device functionality while addressing reliability through unified manufacturing and alignment processes, eliminating the need for separate assembly steps that could introduce failures.
Solution Approach 2:
The patent incorporates alignment features during the manufacturing process itself, rather than requiring post-manufacturing alignment. The alignment features are pre-formed on both the optical component and MEMS structure, enabling automatic alignment during assembly. This preliminary action ensures reliable integration without requiring complex post-processing alignment procedures.
2Volume of moving object
If device size is reduced to fit more features, then more functionality is achieved, but manufacturing cost and reliability deteriorate
Solution Approach 1:
By integrating optical components and MEMS devices into a single compact assembly, the patent achieves more functionality within a smaller device volume. The merged structure eliminates the need for separate housings and mounting mechanisms, reducing overall device size while maintaining reliability through unified construction.
Solution Approach 2:
The patent employs a nested arrangement where the optical component is positioned within or attached directly to the MEMS structure, maximizing space utilization. This nesting approach allows multiple features to coexist in a compact footprint, enabling smaller device size without sacrificing reliability, as all components share a common structural framework.
3Ease of manufacture
If alignment features are added to integrate optical components with MEMS structures, then integration is enabled, but device complexity increases
Solution Approach 1:
The alignment features are pre-formed during the manufacturing process of both the optical component and MEMS structure, rather than being added as separate post-processing elements. This preliminary action simplifies the overall manufacturing workflow by combining alignment feature creation with standard manufacturing steps, reducing device complexity while enabling successful integration.
Solution Approach 2:
The alignment features serve multiple functions: they provide alignment during assembly, act as attachment points for securing the optical component, and can serve as structural reinforcement elements. This multi-functionality reduces the need for separate components, simplifying the overall device structure while maintaining ease of manufacture through integrated design.
Data Source
AI summary
A device can have an optical component having at least one alignment/attachment feature and a MEMS structure having a complimentary alignment/attachment feature for each alignment/attachment feature of the optical component. Each alignment/attachment feature of the optical component can mate with a corresponding alignment/attachment of the MEMS structure to align and/or attach the optical component to the MEMS structure. Thus, improved combinations of optical components and MEMS devices can be provided.