Wafer Scale Waffle Pack Handling Semiconductor Dies
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Solution Overview
Problem
Conventional waffle packs are inefficient in handling a large number of semiconductor dies from a wafer, requiring multiple packs and increasing handling steps, and can cause front-side surface damage during processing.
Innovation Solution
A waffle pack device with recesses compatible with semiconductor wafer processing, capable of accommodating a majority of dies from a single wafer, featuring channels for effluent direction and a lid design that prevents die surface contact, allowing for minimal movement and efficient processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional waffle packs are used to store and handle individual die, then the amount of individual die handling is reduced, but a large number of waffle packs are required to accommodate all die from a semiconductor wafer
Solution Approach 1:
The patent merges multiple conventional waffle packs into a single integrated wafer-scale waffle pack that can accommodate all or most die from a semiconductor wafer. This consolidation reduces the number of separate handling operations and packaging steps while maintaining the protective and organizational functions of individual waffle packs.
Solution Approach 2:
The patent transitions from handling die at the individual level across multiple small waffle packs to handling die at the wafer scale level using a single large waffle pack. This dimensional shift allows processing entire wafer batches simultaneously rather than individual die, significantly reducing the number of packs and handling steps required.
2Adaptability or versatility
If multiple different waffle packs are used to provide all different types of die needed for multi-chip semiconductor packages, then die of various sizes and shapes can be accommodated, but the complexity of the packaging process increases
Solution Approach 1:
The patent creates a universal wafer-scale waffle pack design that can accommodate die of various sizes, shapes, and types within a single package. The structure includes adjustable or configurable recesses that can be adapted to hold different die configurations, eliminating the need for multiple specialized waffle packs for different die types.
Solution Approach 2:
The waffle pack is divided into multiple recesses or compartments that can be individually configured to accommodate different die sizes and shapes. This segmentation allows each recess to be optimized for specific die types while maintaining a unified package structure that handles all die types together.
3Reliability
If conventional waffle packs are used for die storage and handling, then die can be protected during intermediate steps, but front-side surface damage can occur to the die
Solution Approach 1:
The patent introduces an intermediary protective layer or mechanism between the die front surface and the waffle pack structure. This intermediary element prevents direct contact between the die front-side surface and potential damage sources in the waffle pack, such as sharp edges or rough surfaces, while still allowing the waffle pack to provide structural support and protection.
Data Source
AI summary
A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit. Another semiconductor device assembly method is provided which removes die from at least one waffle pack device, places die from the at least one waffle pack device on a semiconductor package to assemble from the placed die device components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.