Semiconductor Package Wafer Classification by Test Score
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Solution Overview
Problem
Semiconductor packages manufactured on the same wafer often have varying electrical characteristics due to physical or chemical limitations, leading to defects and inefficient packaging, as well as the need for diverse performance standards across different electronic devices.
Innovation Solution
A method of manufacturing semiconductor packages by classifying dies based on performance requirements, involving testing, scoring, and packaging according to reference values specific to each semiconductor product, ensuring consistent quality and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dies are packaged in manufacturing order without classification, then packaging process is simple, but electrical characteristics vary and defects increase
Solution Approach 1:
The patent applies preliminary action by performing testing and scoring of dies before the packaging process. Test scores are calculated in advance based on electrical characteristics, and dies are classified into groups according to their scores. This preliminary classification ensures that dies with similar electrical characteristics are packaged together, improving reliability without adding complexity to the actual packaging operation.
2Productivity
If dies are classified by testing and scoring, then packaging efficiency improves, but test operations and score calculation add process steps
Solution Approach 1:
Testing and scoring are performed as preliminary actions before packaging, allowing dies to be pre-classified by their electrical characteristics. This enables efficient packaging by grouping compatible dies together, improving productivity while the added process steps are consolidated into a systematic classification framework.
Solution Approach 2:
The patent introduces a scoring parameter system that quantifies electrical characteristics into test scores. By changing the parameter representation from raw electrical measurements to standardized scores, the system enables efficient classification and grouping of dies, improving packaging efficiency through data-driven decision making.
3Quantity of substance
If all dies on a wafer are packaged regardless of performance, then packaging volume is maximized, but yield decreases due to defects
Solution Approach 1:
The patent applies local quality by classifying dies into different groups based on their individual test scores and electrical characteristics. Instead of treating all dies uniformly, each die is evaluated and assigned to a specific package group that matches its performance level. This ensures that each packaged die meets the appropriate quality standards, maintaining high yield while maximizing the number of usable dies from each wafer.
Data Source
AI summary
A method of manufacturing a semiconductor package includes manufacturing dies on each of wafers, testing the wafers including the dies, calculating total scores for the wafers according to results of the tests, and setting reference values corresponding to semiconductor products. The method also includes classifying, as the semiconductor product, a selected wafer having a total score corresponding to a selected reference value among the reference values. The method further includes packaging the dies included in the selected wafer.