Wafer Scribe Layout With Laser Pad Removal to Prevent Underfill Peeling

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Solution Overview

Problem

Conventional semiconductor device manufacturing methods often result in peeling issues between semiconductor chips and underfill materials, which affects the reliability and durability of the semiconductor package.

Innovation Solution

A method involving the use of monitor pads in scribe areas of semiconductor wafers, where laser beams are used to remove portions of these pads before dicing, reducing the contact area between the underfill and the pads, thereby enhancing adhesion and minimizing peeling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If monitor pads are provided in the scribe area, then electrical characteristics can be monitored, but peeling occurs between the semiconductor chip and underfill material

Engineering Contradiction:

Improveelectrical characteristics monitoringVSAvoidadhesion between semiconductor chip and underfill

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The scribe area is divided into a first area and second areas. Monitor pads are provided only in the second areas, while the first area is used for dicing. This segmentation separates the monitoring function from the dicing area, preventing peeling while maintaining electrical characteristics monitoring capability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Monitor pads are selectively provided in specific regions (second areas) of the scribe area rather than uniformly across the entire scribe area. This local quality approach ensures monitoring capability is concentrated in areas that do not interfere with the dicing process and underfill adhesion.

Inventive Principle:

Principle #3Local quality

2Productivity

If the entire scribe area is used for dicing, then manufacturing efficiency is improved, but electrical characteristics cannot be monitored

Engineering Contradiction:

Improvedicing efficiencyVSAvoidelectrical characteristics monitoring

Core Design Contradiction:

ProductivityVSMeasurement precision

Solution Approach 1:

The scribe area is segmented into a first area dedicated to dicing operations and second areas dedicated to monitor pad placement. This allows simultaneous optimization of both dicing efficiency and electrical characteristics monitoring by assigning specific functions to specific regions.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The monitor pads are arranged in specific spatial configurations (second areas on both sides of the first area) within the scribe area. This spatial arrangement allows monitoring functionality to coexist with dicing operations by utilizing different zones within the same planar area.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If monitor pads are removed by laser beam, then peeling is reduced, but additional process steps are required

Engineering Contradiction:

Improveadhesion between semiconductor chip and underfillVSAvoidnumber of process steps

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The laser beam removal of monitor pads is performed before the dicing process. This preliminary action eliminates the source of peeling problems in advance, preventing adhesion issues before they affect the final product quality and reliability.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The mechanical process of monitor pad removal is replaced with laser beam processing. This substitution provides more precise and controlled removal of monitor pads, reducing mechanical stress and improving adhesion properties compared to traditional mechanical methods.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces peeling between semiconductor devices and underfill materials, improving the adhesion properties and reliability of the semiconductor package.

Implementation Method 1

removing at least portions of the monitor pads by emitting laser beam to the second areas

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS11990373B2Method for producing semiconductor device, semiconductor package, and method for producing semiconductor package

Publication Date: 2024.05.21 SOCIONEXT INC

AI summary

A method for producing a semiconductor device includes dicing, at a scribe area of a semiconductor wafer, the semiconductor wafer into semiconductor chips including respective circuit areas formed on the semiconductor wafer, the scribe area being provided between the circuit areas and extending in a first direction in a plan view, wherein the scribe area includes a first area extending in the first direction and second areas including monitor pads and extending in the first direction and located on both sides of the first area, wherein the method includes removing at least portions of the monitor pads by emitting laser beam to the second areas before the dicing, and wherein, in the dicing, the semiconductor wafer is diced at the first area.