Wafer Treating Sealing Ring With Elastic Lip And Carrier
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Solution Overview
Problem
Existing wafer treating devices face challenges in ensuring a reliable seal between the wafer and the cover ring to prevent liquid from entering the vacuum chamber or untreated regions, which can lead to contamination and inefficiencies in liquid removal.
Innovation Solution
A two-part sealing system comprising an annular carrier with a groove and a sealing lip with a bead, where the sealing lip is releasably attached and extends beyond the carrier's lower side to create a self-retaining seal, supported by the carrier's conical bearing surface, and venting channels ensure efficient liquid discharge and prevention of liquid ingress into the vacuum chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a seal is provided between the cover ring and the wafer or carrier film, then liquid ingress into the vacuum chamber is prevented, but the seal may still allow liquid to pass behind it during centrifugal removal
Solution Approach 1:
The patent implements a nested sealing structure where an inner seal (sealing lip 42) and an outer seal (sealing insert 36) are positioned concentrically. The inner seal provides the primary sealing interface, while the outer seal acts as a backup to prevent liquid from passing behind the inner seal during centrifugal removal operations
Solution Approach 2:
The pressing rib 56 serves as an intermediary mechanical element that actively presses the carrier film 30 against the sealing insert 36, ensuring enhanced contact and sealing effectiveness at the outer seal location to prevent liquid ingress
2Reliability
If a rigid seal structure is used to ensure reliable sealing, then sealing effectiveness is improved, but the seal cannot adapt to different applications or replace wear
Solution Approach 1:
The sealing system is divided into separate, replaceable components: the sealing lip 42, the sealing insert 36, and the carrier 40. This segmentation allows individual components to be replaced independently based on wear or application requirements, providing flexibility while maintaining reliable sealing
Solution Approach 2:
The sealing lip 42 is designed with elastic properties, allowing it to deform and adapt to different wafer or carrier film surfaces. This dynamic characteristic enables the same sealing structure to effectively seal different applications while maintaining reliable contact
3Reliability
If the sealing lip is pressed mechanically against the wafer, then sealing force is improved, but high contact forces can occur that may damage the wafer or carrier film
Solution Approach 1:
The sealing mechanism transitions from direct mechanical pressing to elastic deformation-based sealing. The sealing lip 42 utilizes its elastic properties to generate sealing force through controlled deformation, distributing the contact pressure more evenly and avoiding concentrated high forces that could damage the wafer or carrier film
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reliable, efficient seal that prevents liquid from entering the vacuum chamber, allows precise adaptation to different applications, and enables effective liquid removal under centrifugal force, reducing the risk of contamination and mechanical contact forces.
Implementation Method 1
The sealing lip (42) is elastic and is deformed slightly when it lies against the wafer (14) or against the carrier film (30)
Implementation Method 2
the receptacle, together with the wafer, can be rotated an that the liquid is discharged to the outside via a cover ring under the effect of centrifugal force
Implementation Method 3
a vacuum chamber is provided between the cover ring and the receptacle so that a pressing force can be generated when a vacuum is being applied to the vacuum chamber
Data Source
AI summary
A sealing ring for attaching to a cover ring of a wafer treating device has an annular carrier and a sealing lip which is releasably attached to the carrier.