Wafer Temperature Sensor Calibration Liquid Bath
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Solution Overview
Problem
Conventional temperature sensor calibration systems face limitations in accuracy due to vertical thermal gradients and lower production throughput, as sensors are calibrated after packaging, leading to increased costs and reduced calibration efficiency.
Innovation Solution
A system and method for calibrating temperature sensors on a wafer by submerging the wafer in a liquid bath with a temperature controller, using a horizontal configuration to minimize thermal gradients and an electrical connection mechanism for signal reception, allowing for precise calibration of sensors before packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If IC sensors are packaged before calibration, then the sensors are protected and easier to handle, but the calibration accuracy decreases due to vertical thermal gradients and production throughput decreases
Solution Approach 1:
The patent performs calibration on the wafer before dicing and packaging the sensors. By conducting calibration at the wafer level prior to packaging, the system eliminates the thermal gradient issues that arise when packaged sensors are immersed in liquid baths, thereby maintaining high calibration accuracy while still enabling easy handling through subsequent packaging
2Ease of manufacture
If IC sensors are packaged before calibration, then the sensors are protected, but the production throughput decreases due to larger physical size requiring more processing time
Solution Approach 1:
The patent performs calibration on the wafer before dicing and packaging the sensors. By conducting calibration at the wafer level prior to packaging, the system eliminates the thermal gradient issues that arise when packaged sensors are immersed in liquid baths, thereby maintaining high calibration accuracy while still enabling easy handling through subsequent packaging
3Ease of operation
If boards are mounted vertically in liquid bath, then the setup is simple, but the calibration accuracy decreases due to vertical thermal gradient
Solution Approach 1:
The patent performs calibration on the wafer before dicing and packaging the sensors. By conducting calibration at the wafer level prior to packaging, the system eliminates the thermal gradient issues that arise when packaged sensors are immersed in liquid baths, thereby maintaining high calibration accuracy while still enabling easy handling through subsequent packaging
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances calibration accuracy and reduces costs by enabling more efficient calibration of sensors in a wafer format, improving production throughput and accuracy while minimizing thermal gradient effects.
Implementation Method 1
a liquid bath with a temperature controller, using a horizontal configuration to minimize thermal gradients
Data Source
AI summary
A system for calibrating sensors in a wafer is provided. The system includes a container for containing liquid and configured to accommodate the wafer in the liquid; a temperature controller for controlling a temperature of the liquid; and an electrical connection mechanism for receiving electrical signals to the sensors when the temperature of the liquid reaches a preset level during operation. The system also includes a device that receives the signals from the sensors and calibrates the sensors based on the temperature of the liquid and the received signals from the sensors.