Wafer Magnetic Sensor Calibration for Stable Semiconductor Processing
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Solution Overview
Problem
Semiconductor devices face reliability and productivity issues due to offset errors in sensors used during manufacturing processes, which can affect the final dimensions and properties of the devices.
Innovation Solution
A manufacturing apparatus for semiconductor devices incorporating a wafer-type magnetic sensor with a measuring sensor and a calibrator that performs frequent offset calibration without additional equipment, using a reference sensor to maintain a zero-offset state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If offset calibration is performed frequently to maintain sensor accuracy, then measurement precision is improved, but device complexity increases due to additional calibration equipment and processes
Solution Approach 1:
The patent combines the calibration sensor and measuring sensor into a single wafer structure, allowing both sensors to be manufactured and calibrated together. This integration eliminates the need for separate calibration equipment and processes, reducing device complexity while maintaining the ability to perform frequent offset calibration for high measurement precision
Solution Approach 2:
The calibration sensor on the wafer serves itself by providing reference measurements that enable automatic offset calibration of the measuring sensor. The system uses its own integrated calibration sensor to perform calibration without external equipment, simplifying the overall system while maintaining measurement accuracy
2Reliability
If offset calibration is performed frequently to maintain zero-offset state, then reliability of semiconductor device manufacturing is improved, but loss of time occurs due to additional calibration processes
Solution Approach 1:
The wafer is pre-equipped with a calibration sensor during manufacturing, so that offset calibration can be performed immediately when needed without requiring external calibration equipment or processes. This preliminary preparation enables quick calibration operations that maintain reliability while minimizing time loss
Solution Approach 2:
The patent replaces complex external mechanical calibration systems with an integrated electronic sensor-based calibration approach. The calibration sensor provides electronic reference signals that enable automated offset calibration, reducing both the complexity and time required for calibration processes while maintaining manufacturing reliability
3Measurement precision
If additional calibration equipment is added to perform offset calibration, then measurement precision is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The calibration sensor and measuring sensor are merged into a single wafer structure, eliminating the need for separate calibration equipment. This integration maintains measurement precision through accurate offset calibration while significantly reducing system structure complexity
Solution Approach 2:
The wafer structure serves multiple functions: it acts as both the substrate for the measuring sensor and as the carrier for the calibration sensor. This multi-functionality allows the same physical structure to provide both measurement and calibration capabilities, reducing the need for additional dedicated calibration equipment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform process conditions, enhancing the reliability and productivity of semiconductor devices by minimizing the impact of sensor offset errors.
Implementation Method 1
a wafer-type magnetic sensor including a wafer body portion and at least one measuring sensor at or in the wafer body portion
Implementation Method 2
a calibrator configured to perform an offset calibration of the at least one measuring sensor
Data Source
AI summary
Embodiments include a manufacturing apparatus of a semiconductor device. The manufacturing apparatus may include a wafer-type magnetic sensor and a calibrator. The wafer-type magnetic sensor may include a wafer body portion and a measuring sensor at or in the wafer body portion. The calibrator may be configured to perform an offset calibration of the measuring sensor.