Wafer-Like Sensor Substrate Using Hardened Glass for RF-Safe Chucking
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Solution Overview
Problem
Semiconductor processing systems require a wafer-like sensor substrate that is flat, smooth, dimensionally stable, and non-contaminating, yet strong enough to prevent fractures and interference with radio frequency communications, while existing materials like silicon fracture easily and carbon fiber composites are not smooth or flat enough for reliable vacuum chucking.
Innovation Solution
A wafer-like semiconductor sensor is constructed using a sandwich of chemically-hardened glass layers, with an annular top piece and a bottom disk, including an anti-shatter film and painted surfaces to prevent contamination and breakage, allowing for a strong yet thin design that does not interfere with RF communications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If silicon is used as the wafer-like substrate, then the substrate can be made thin and smooth, but it fractures easily and lacks dimensional stability
Solution Approach 1:
The patent uses a composite substrate structure consisting of a silicon core layer bonded to a glass overlay layer. The silicon core provides smoothness and RF transparency, while the glass overlay provides mechanical strength and fracture resistance. This composite approach resolves the contradiction by combining materials with complementary properties.
2Strength
If carbon fiber composite is used as the wafer-like substrate, then the substrate provides high strength, but it is not smooth or flat enough for reliable vacuum chucking
Solution Approach 1:
The glass overlay layer in the composite substrate provides a smooth, flat surface that enables reliable vacuum chucking, while the silicon core and overall structure maintain high strength. The glass surface has the necessary optical and mechanical properties for precision handling.
3Reliability
If the substrate is made thin to allow RF communication, then RF signal transmission is improved, but the substrate becomes more fragile and less dimensionally stable
Solution Approach 1:
The thin silicon core layer (approximately 0.375 mm) provides RF transparency while the bonded glass overlay layer provides dimensional stability and mechanical support. The composite structure allows the substrate to be thin enough for RF communication while maintaining stability through the combined properties of the layered materials.
4Device complexity
If a single-layer substrate is used, then the structure is simple, but it cannot provide both strength and smoothness simultaneously
Solution Approach 1:
The two-layer composite structure (silicon core + glass overlay) provides both strength and smoothness simultaneously. The glass overlay layer specifically contributes optical smoothness and mechanical strength, while the silicon core provides RF transparency and structural support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The chemically-hardened glass substrate provides a stable and non-contaminating surface for the sensor, preventing shards from dislodging during breakage and ensuring reliable vacuum chucking, while maintaining the integrity of RF communications, thus enabling precise and contamination-free measurements within semiconductor processing systems.
Implementation Method 1
an annular layer formed of chemically-hardened glass and a lower layer formed of chemically-hardened glass, wherein the annular layer is chemically bonded to the lower layer
Implementation Method 2
The wireless wafer-like sensor does not require that a vacuum chamber be vented or pumped down
Data Source
AI summary
A wafer-like semiconductor sensor includes a wafer-like base formed of a plurality of layers of chemically-hardened glass and an electronics module mounted to a recessed pocket in the base and containing a sensor.