Wafer Type Sensor Auto Teaching for Ring Assembly Alignment

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Solution Overview

Problem

The ring assembly in an electrostatic chuck, used in etching facilities for semiconductor manufacturing, deteriorates over time and requires periodic replacement to maintain substrate processing efficiency, but its misalignment can adversely affect the process.

Innovation Solution

An auto teaching system using a wafer type sensor, control device, and control program for monitoring and automatically charging the sensor, ensuring proper alignment and battery level, and a wafer type sensor storage device and charging device for seamless operation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the ring assembly is periodically replaced, then the substrate processing efficiency is maintained, but the alignment accuracy may deteriorate due to manual replacement errors

Engineering Contradiction:

Improvesubstrate processing efficiencyVSAvoidalignment accuracy

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The system performs self-alignment by automatically detecting the ring assembly position using a sensor and adjusting the robot's teaching data to compensate for misalignment, eliminating the need for manual realignment after replacement

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent replaces manual mechanical alignment with an automated optical detection and data processing system that uses sensor measurements and computer-controlled adjustments to achieve precise alignment

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Duration of action of stationary object

If the ring assembly is not replaced periodically, then the system operates continuously, but the processing quality deteriorates due to wear and misalignment

Engineering Contradiction:

Improvecontinuous operation timeVSAvoidprocessing quality

Core Design Contradiction:

Duration of action of stationary objectVSManufacturing precision

Solution Approach 1:

The system continuously monitors the ring assembly position using a sensor and provides feedback to the control device, which automatically adjusts the teaching data to maintain alignment accuracy throughout the ring assembly's service life

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The system performs alignment detection and adjustment automatically upon ring assembly replacement, preparing the system for optimal performance before resuming continuous operation

Inventive Principle:

Principle #10Preliminary action

3Manufacturing precision

If manual alignment checking is performed, then the alignment accuracy is verified, but the downtime increases due to manual intervention

Engineering Contradiction:

Improvealignment verificationVSAvoiddowntime

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The system performs automatic alignment verification using a sensor that detects the ring assembly position without requiring manual intervention, eliminating downtime associated with manual checking

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent replaces manual visual inspection and physical measurement with an automated optical sensor system that quickly and accurately verifies alignment

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS12405308B2Control program, container and semiconductor device manufacturing system for charging of wafer type sensor and auto teaching

Publication Date: 2025.09.02 SYSTEM ENGINEERING MEGA SOLUTION CO LTD

AI summary

The present disclosure provides a control device for charging and auto teaching of a wafer type sensor, a control program executed by the control device, a wafer type sensor storage device, a wafer type sensor charging device, and a semiconductor device manufacturing facility. The control program is a program executed by a control device equipped with a processor, and monitors a semiconductor device manufacturing facility and its part using a wafer type sensor, and monitors the remaining battery level of the wafer type sensor.