Wafer Separation System with Integrated Cleaning for Throughput
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Solution Overview
Problem
The existing separation systems for semiconductor wafers require separate apparatuses for cleaning the wafer and supporting substrate, leading to inefficiencies in throughput during the separation processing.
Innovation Solution
A separation system that integrates a separation processing station, transfer-in/out station, and transfer units, including first and second cleaning units, to efficiently separate and clean the processing target substrate and supporting substrate in a single system, allowing concurrent cleaning and processing of multiple substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If separate apparatuses are used for cleaning the wafer and supporting substrate, then the separation processing can be performed, but the throughput of the separation processing is reduced
Solution Approach 1:
The patent combines multiple separate apparatuses (separation unit, first cleaning unit, and second cleaning unit) into a single integrated separation system. The separation processing station houses all three units, allowing the wafer and supporting substrate to be separated and cleaned in sequence within one system, eliminating the need for discrete apparatuses and improving throughput.
Solution Approach 2:
The separation processing station is designed as a multi-functional unit that can perform separation, first cleaning, and second cleaning operations. The transfer unit enables the system to handle multiple substrates sequentially, making the single apparatus capable of performing multiple functions that previously required separate devices.
2Productivity
If the wafer and supporting substrate are cleaned in discrete apparatuses, then the separation can be completed, but the series of separation processing cannot be efficiently performed
Solution Approach 1:
The integrated separation system enables continuous processing where the wafer and supporting substrate move sequentially through the separation unit, first cleaning unit, and second cleaning unit without interruption. The transfer unit coordinates the movement to ensure continuous operation, eliminating idle time between separation and cleaning operations that would occur with discrete apparatuses.
Solution Approach 2:
The system performs cleaning operations immediately after separation within the same processing station, preparing the substrates for subsequent steps without delay. The first cleaning unit cleans the wafer right after separation, and the second cleaning unit cleans the supporting substrate concurrently, ensuring substrates are ready for reuse or next processing steps without waiting time.
3Productivity
If multiple substrates are processed sequentially in separate apparatuses, then each substrate can be handled, but the overall processing time increases
Solution Approach 1:
The transfer unit coordinates the movement of multiple wafers and supporting substrates through the separation and cleaning units in a continuous flow. While one substrate pair is being separated, another can be moving into position for separation, and cleaned substrates can be transferred out for reuse, maintaining continuous productive action across multiple processing cycles.
Solution Approach 2:
The integrated system automatically manages the transfer and coordination of multiple substrates through the various units without requiring external intervention between steps. The transfer unit autonomously moves substrates between separation and cleaning units, and the system self-coordinates the timing to maximize throughput, reducing idle time and enabling efficient batch processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the throughput of the separation processing by enabling efficient separation and cleaning of substrates within a single system, improving the yield and reducing manufacturing costs by allowing concurrent processing and reuse of substrates.
Implementation Method 1
a nozzle jetting liquid between the wafer and the supporting substrate. Then, in this separation unit, by jetting liquid between the joined wafer and supporting substrate from the nozzle at a jetting pressure greater than the joint strength
Implementation Method 2
a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit
Data Source
AI summary
The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit.