Wafer Separation Device with Linear Carrying Path
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Solution Overview
Problem
Current methods for separating a support plate from a substrate in semiconductor wafer processing are not automated, leading to inefficient processing and manual handling due to the reduced strength of thin wafers, which can crack or curve.
Innovation Solution
A separating device with a first storing section, multiple processing sections for reducing adhesive force, and carrying sections that move in a straight line to efficiently carry and process the laminate, allowing for automated separation of the support plate from the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the wafer thickness is reduced to increase chip density, then the chip density is improved, but the wafer strength is reduced making it difficult to convey automatically
Solution Approach 1:
The wafer conveying process is segmented into multiple stations along a linear path, with each station performing a specific function (bonding, processing, separation). This allows the thin wafer to be supported and handled at different points without requiring manual intervention throughout the entire process.
Solution Approach 2:
A support plate is introduced as an intermediary component to support the thin wafer during processing. The support plate provides mechanical strength to the wafer, enabling automated conveying while the wafer maintains its reduced thickness for high chip density.
2Strength
If manual handling is used to convey thin wafers, then the wafer strength is maintained, but processing efficiency is reduced
Solution Approach 1:
The system uses automated mechanisms that self-service the thin wafer through the entire process. The wafer is automatically conveyed on the support plate through bonding, processing, and separation stations without requiring manual handling, thereby maintaining both wafer strength and high processing efficiency.
3Productivity
If automated separation is implemented, then processing efficiency is improved, but device complexity increases
Solution Approach 1:
The separating device uses a dynamic approach where the support plate and wafer are conveyed through a linear sequence of processing stations. The separation function is integrated into the conveying system, with processing sections that can be activated at different stations along the linear path, simplifying the overall device architecture while maintaining automated separation capability.
4Productivity
If multiple processing sections are added along the carrying path, then processing efficiency is improved, but device complexity increases
Solution Approach 1:
Instead of adding multiple processing sections in a complex multi-dimensional arrangement, the invention extends the processing path in a single linear dimension. Multiple processing sections are arranged sequentially along the linear carrying path, allowing efficient processing while maintaining a simple, organized device structure that is easier to control and maintain.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enables efficient and automated separation of the support plate from the substrate, improving processing efficiency and preventing damage to the wafer by allowing straight-line movement and multiple processing sections along the carrying path.
Implementation Method 1
a side of the wafer which side is not bonded to the support plate is bonded to another support member such as a dicing tape, depending on a thickness of the wafer
Data Source
AI summary
A separating device according to the present invention separates a support plate (14) from a substrate (12) of a laminate (10) including the substrate (12) and the support plate (14) bonded to each other. The separating device includes: a first storing section (20) for storing the laminate (10); a plurality of first processing sections (30) for reducing adhesive force of an adhesive (13) applied between the substrate (12) and the support plate (14); and a first carrying section (50) which is capable of moving in the first direction and carries the laminate (10) from the first storing section (20) to the first processing section (30) while holding the laminate (10). With the first carrying section (50), it is possible to provide a separating device (100) which moves straightly so as to carry the laminate (10). This provides a separating device for (i) processing a laminate including a substrate and a support plate and (ii) separating the support plate from the substrate, which separating device performs the separating process efficiently.