Wafer Separation Surface Cleaning for Contamination Control
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Solution Overview
Problem
Existing wafer separation methods leave dust or debris on the separation surface, which can contaminate subsequent processing apparatuses and transfer mechanisms, and there is a lack of effective cleaning methods to address this issue.
Innovation Solution
A wafer processing system equipped with a separating apparatus that includes a first holder, a second holder, a moving unit, and a separation surface cleaning unit to clean the separation surfaces of the first and second separation bodies, ensuring proper separation and cleaning of the surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If wafer separation is performed using existing methods, then the separation process is simple and fast, but dust or debris remains on the separation surface causing contamination of subsequent processing apparatuses
Solution Approach 1:
The patent applies preliminary action by cleaning the separation surface before the wafer separation process. The cleaning unit removes dust and debris from the separation surface of the first holder before the wafer is separated, preventing contamination of subsequent processing apparatuses. This advance cleaning action eliminates the harmful effect of contamination without requiring complex post-separation cleaning systems.
2Reliability
If a cleaning unit is added to the separation apparatus, then separation surface contamination is reduced, but the device complexity increases
Solution Approach 1:
The cleaning unit is designed to automatically clean the separation surface without requiring external intervention or complex manual cleaning systems. The cleaning mechanism serves itself by being an integrated part of the separation apparatus, performing the cleaning function automatically during the separation process. This self-service approach maintains reliability while minimizing the increase in device complexity.
3Object-affected harmful factors
If the separation surface is cleaned after separation, then contamination is removed, but processing time is increased
Solution Approach 1:
The patent performs the cleaning action before the wafer separation process rather than after. The cleaning unit cleans the separation surface of the first holder in advance, so that when separation occurs, the surface is already clean. This eliminates the need for post-separation cleaning, thereby avoiding any increase in processing time while still removing dust and debris effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively separates wafers while minimizing contamination by efficiently cleaning the separation surfaces, preventing apparatus contamination and ensuring clean transfer processes.
Implementation Method 1
a condensing point of a laser beam is set to be positioned inside the first wafer. By moving the first wafer horizontally relative to the condensing point while radiating the laser beam, a modification surface is formed within the first wafer
Data Source
AI summary
A separating apparatus configured to separate a processing target object into a first separation body and a second separation body includes a first holder configured to hold the first separation body; a second holder configured to hold the second separation body; a moving unit configured to move the first holder and the second holder relatively to each other; and a separation surface cleaning unit configured to clean at least a separation surface of the first separation body or a separation surface of the second separation body.